Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960052 | Methods for etching a metal layer to form an interconnection structure for semiconductor applications | Sumit Agarwal, Chiu-pien KUO, Mark Hoinkis, Bradley J. Howard | 2018-05-01 |
| 6921493 | Method of processing substrates | Brett C. Richardson, Sterling M. Goyer | 2005-07-26 |