Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315746 | Bottom cover plate to reduce wafer planar nonuniformity | Zubin Huang, Srinivas Tokur Mohana, Sandesh Yadamane, Kai WU, Jallepally Ravi +1 more | 2025-05-27 |
| 12094773 | Methods for low resistivity and stress tungsten gap fill | Xi Cen, Kai Wu, Min Heon, Wei Min Chan, Tom Ho Wing Yu +4 more | 2024-09-17 |
| 12037682 | Methods for forming low resistivity tungsten features | Cheng-Liang Cheng, Kai Wu, Insu HA, Sang Jin Lee | 2024-07-16 |
| 11939668 | Gas delivery for tungsten-containing layer | Zubin Huang, Mohammed Jaheer SHERFUDEEN, David Santi, Jallepally Ravi, Kai WU | 2024-03-26 |
| 11798845 | Methods and apparatus for low resistivity and stress tungsten gap fill | Xi Cen, Kai Wu, Min Heon, Wei Min Chan, Tom Ho Wing Yu +4 more | 2023-10-24 |
| 11657733 | Training method for evaluating bonding accuracy of orthodontic brackets | Chaoran Xue, Bin Li, Ding Bai, Xianglong HAN, Hui Xu +5 more | 2023-05-23 |