{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Mediatek", "item": "https://www.patentleaderboard.com/company/mediatek"}, {"@type": "ListItem", "position": 3, "name": "Kai WU", "item": "https://www.patentleaderboard.com/inventor/fl:ka_ln:wu-43"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
KW

Kai WU — 6 Patents

MEMediatek: 2 patents #1,178 of 2,888Top 45%
Palo Alto, CA: #3,345 of 9,675 inventorsTop 35%
California: #94,478 of 386,348 inventorsTop 25%
Overall (All Time): #779,687 of 4,157,543Top 20%
6 Patents All Time
Kai WU has been granted 6 US patents while listed as an inventor at Mediatek. The first was granted in 2017 and the most recent in December 2025. Kai WU ranks #779,687 of 4,157,543 US inventors in our database (top 18.8%). Patent records list Kai WU in Palo Alto, CA, US.

Patents per Year

Patents granted per year, 2017 to 2025Bar chart with a peak of 3 patents in 2025.peak 32017: 1 patents20172018: 1 patents20182024: 1 patents20242025: 3 patents2025

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12504293 Electric vehicle charging recommendation systems and methods Dominique Meroux, Yajiao Fu, Changsong Zhang, Hyun Woong Park, Venkatarao Rebba 2025-12-23
12502999 Systems and methods to improve transportation efficiencies Dominique Meroux, Changsong Zhang 2025-12-23
12315746 Bottom cover plate to reduce wafer planar nonuniformity Zubin Huang, Srinivas Tokur Mohana, Sandesh Yadamane, Jallepally Ravi, Xiaozhou YU +1 more 2025-05-27
11939668 Gas delivery for tungsten-containing layer Zubin Huang, Mohammed Jaheer SHERFUDEEN, David Santi, Jallepally Ravi, Peiqi WANG 2024-03-26 $55,219,000
9947624 Semiconductor package assembly with through silicon via interconnect Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin +2 more 2018-04-17
9570399 Semiconductor package assembly with through silicon via interconnect Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin +2 more 2017-02-14