Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315746 | Bottom cover plate to reduce wafer planar nonuniformity | Zubin Huang, Srinivas Tokur Mohana, Sandesh Yadamane, Jallepally Ravi, Xiaozhou YU +1 more | 2025-05-27 |
| 11939668 | Gas delivery for tungsten-containing layer | Zubin Huang, Mohammed Jaheer SHERFUDEEN, David Santi, Jallepally Ravi, Peiqi WANG | 2024-03-26 |
| 9947624 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin +2 more | 2018-04-17 |
| 9570399 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Tzu-Hung Lin +2 more | 2017-02-14 |