Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8900999 | Low temperature high pressure high H2/WF6 ratio W process for 3D NAND application | Sang-Hyeob Lee, Joshua Collins, KieJin Park | 2014-12-02 |
| 8865594 | Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance | Sang-Hyeob Lee, Sang Ho Yu | 2014-10-21 |
| 8835311 | High temperature tungsten metallization process | Joshua Collins, Murali Narasimhan, Jingjing Liu, Sang-Hyeob Lee, Avgerinos V. Gelatos | 2014-09-16 |
| 8617985 | High temperature tungsten metallization process | Joshua Collins, Murali Narasimhan, Jingjing Liu, Sang-Hyeob Lee, Avgerinos V. Gelatos | 2013-12-31 |
| 8513116 | Atomic layer deposition of tungsten materials | Amit Khandelwal, Madhu Moorthy, Avgerinos V. Gelatos | 2013-08-20 |
| 8211799 | Atomic layer deposition of tungsten materials | Amit Khandelwal, Madhu Moorthy, Avgerinos V. Gelatos | 2012-07-03 |
| 8071478 | Method of depositing tungsten film with reduced resistivity and improved surface morphology | Amit Khandelwal, Averginos V. Gelatos | 2011-12-06 |
| 7964505 | Atomic layer deposition of tungsten materials | Amit Khandelwal, Madhu Moorthy, Avgerinog V. Gelatos | 2011-06-21 |
| 7732327 | Vapor deposition of tungsten materials | Sang-Hyeob Lee, Avgerinos V. Gelatos, Amit Khandelwal, Ross Marshall, Emily Renuart +2 more | 2010-06-08 |