Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of dielectric material fill and treatment

Method of dielectric material fill and treatment

US Patent 12046508 · Granted Jul 23, 2024

Estimated economic value: $84,339,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi color stack for self aligned dual pattern formation for multi purpose devi2025
Multi color stack for self aligned dual pattern formation for multi purpose devi2025
Integrated flowable low-k gap-fill and plasma treatment2025
Integrated flowable low-k gap-fill and plasma treatment2025
Metal based hydrogen barrier2025
Monolithic complementary field-effect transistors having carbon-doped release la2025
Methods of post treating silicon nitride based dielectric films with high energy2025
Plasma treatment process to densify oxide layers2024
Device enclosure temperature control2024
Fluorine-free tungsten ALD for dielectric selectivity improvement2024
Fluorine-free tungsten ALD for dielectric selectivity improvement2024
Metal based hydrogen barrier2024