Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062942 | Methods for controllable metal and barrier-liner recess | Amrita B. Mullick, Regina Freed, Mehul Naik, Uday Mitra | 2021-07-13 |
| 11037825 | Selective removal process to create high aspect ratio fully self-aligned via | Amrita B. Mullick, Madhur Sachan, Swaminathan Srinivasan, Regina Freed, Uday Mitra | 2021-06-15 |
| 10957533 | Methods for etching a structure for semiconductor applications | Hao Jiang, Hao Chen, Mehul Naik | 2021-03-23 |
| 10916433 | Methods of forming metal silicide layers and metal silicide layers formed therefrom | Maximillian Clemons, Mei-Yee Shek, Minrui Yu, Bencherki Mebarki, Mehul Naik +2 more | 2021-02-09 |
| 10790191 | Selective removal process to create high aspect ratio fully self-aligned via | Amrita B. Mullick, Madhur Sachan, Swaminathan Srinivasan, Regina Freed, Uday Mitra | 2020-09-29 |
| 10727119 | Process integration approach of selective tungsten via fill | Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik, Zhiyuan Wu +2 more | 2020-07-28 |
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, Mehul Naik, David Thompson +6 more | 2020-07-07 |
| 10692734 | Methods of patterning nickel silicide layers on a semiconductor device | Jong Mun Kim, Chentsau Chris Ying, Srinivas D. Nemani, Ellie Yieh | 2020-06-23 |
| 10692759 | Methods for manufacturing an interconnect structure for semiconductor devices | Hao Jiang, Hao Chen, Mehul Naik | 2020-06-23 |
| 10685849 | Damage free metal conductor formation | Jong Mun Kim, Maximillian Clemons, Minrui Yu, Mehul Naik, Chentsau Chris Ying | 2020-06-16 |
| 10651043 | Process integration method to tune resistivity of nickel silicide | Minrui Yu, Mehul Naik | 2020-05-12 |
| 10643895 | Self-aligned interconnects formed using subtractive techniques | Bencherki Mebarki, Huixiong Dai, Yongmei Chen, Mehul Naik | 2020-05-05 |
| 10636704 | Seam-healing method upon supra-atmospheric process in diffusion promoting ambient | Bencherki Mebarki, Sean S. Kang, Keith Tatseun Wong, Mehul Naik, Ellie Yieh +1 more | 2020-04-28 |
| 10546742 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | Mehul Naik, Yong Cao, Yana Cheng, Weifeng YE | 2020-01-28 |
| 10510602 | Methods of producing self-aligned vias | Ying Zhang, Abhijit Basu Mallick, Yung-Chen Lin, Qingjun Zhou, Ho-yung David Hwang +1 more | 2019-12-17 |
| 10438849 | Microwave anneal to improve CVD metal gap-fill and throughput | Jie Zhou, Guannan Chen, Michael W. Stowell, Bencherki Mebarki, Mehul Naik +3 more | 2019-10-08 |
| 10388533 | Process integration method to tune resistivity of nickel silicide | Minrui Yu, Mehul Naik | 2019-08-20 |
| 10256144 | Process integration approach of selective tungsten via fill | Feiyue Ma, Yu Lei, Kai Wu, Mehul Naik, Zhiyuan Wu +2 more | 2019-04-09 |
| 10170299 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | Mehul Naik, Yong Cao, Yana Cheng, Weifeng YE | 2019-01-01 |
| 10113234 | UV assisted silylation for porous low-k film sealing | Bo Xie, Alexandros T. Demos, Vu Ngoc Tran Nguyen, Kelvin Chan, Kang Sub Yim +1 more | 2018-10-30 |
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, Mehul Naik, David Thompson +6 more | 2018-10-23 |
| 10049927 | Seam-healing method upon supra-atmospheric process in diffusion promoting ambient | Bencherki Mebarki, Sean S. Kang, Keith Tatseun Wong, Mehul Naik, Ellie Yieh +1 more | 2018-08-14 |
| 10008448 | Dielectric/metal barrier integration to prevent copper diffusion | Mehul Naik, Yong Cao, Mei-Yee Shek | 2018-06-26 |
| 9793108 | Interconnect integration for sidewall pore seal and via cleanliness | Mehul Naik, Deenesh Padhi, Priyanka DASH, Bhaskar Kumar, Alexandros T. Demos | 2017-10-17 |
| 9761489 | Self-aligned interconnects formed using substractive techniques | Bencherki Mebarki, Huixiong Dai, Yongmei Chen, Mehul Naik | 2017-09-12 |