Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145504 | Method of forming film stacks with reduced defects | Zhijun Jiang, Ganesh Balasubramanian, Arkajit Roy Barman, Hidehiro Kojiri, Xinhai Han +8 more | 2021-10-12 |
| 10113234 | UV assisted silylation for porous low-k film sealing | Bo Xie, Alexandros T. Demos, Kelvin Chan, He Ren, Kang Sub Yim +1 more | 2018-10-30 |
| 7615482 | Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength | Daniel C. Edelstein, Alexandros T. Demos, Stephen M. Gates, Alfred Grill, Steven E. Molis +3 more | 2009-11-10 |
| 7399364 | Hermetic cap layers formed on low-κ films by plasma enhanced chemical vapor deposition | Bok Hoen Kim, Kang Sub Yim | 2008-07-15 |
| 7297376 | Method to reduce gas-phase reactions in a PECVD process with silicon and organic precursors to deposit defect-free initial layers | Kang Sub Yim, Kelvin Chan, Nagarajan Rajagopalan, Josephine Ju-Hwei Chang Liu, Sang-Hoon Ahn +3 more | 2007-11-20 |
| 7285503 | Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition | Bok Hoen Kim, Kang Sub Yim | 2007-10-23 |