Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142468 | Stress treatments for cover wafers | Vinayak Vishwanath Hassan, Meng Cai, Sowjanya Musunuru, Kaushik Alayavalli, Andrew Nguyen | 2024-11-12 |
| 12106958 | Method of using dual frequency RF power in a process chamber | Anup K. Singh, Rick Kustra, Vinayak Vishwanath Hassan, Krishna Nittala, Pramit Manna +2 more | 2024-10-01 |
| 12020911 | Chucking process and system for substrate processing chambers | Ganesh Balasubramanian, Vivek Shah, Jiheng Zhao | 2024-06-25 |
| 11996273 | Methods of seasoning process chambers | Vinayak Vishwanath Hassan, Anup K. Singh | 2024-05-28 |
| 11959174 | Shunt door for magnets in plasma process chamber | Kallol Bera, Sathya Swaroop Ganta, Timothy Joseph Franklin, Kaushik Alayavalli, Akshay Dhanakshirur +1 more | 2024-04-16 |
| 11859275 | Techniques to improve adhesion and defects for tungsten carbide film | Vivek Shah, Anup K. Singh, Ganesh Balasubramanian | 2024-01-02 |
| 11721545 | Method of using dual frequency RF power in a process chamber | Anup K. Singh, Rick Kustra, Vinayak Vishwanath Hassan, Krishna Nittala, Pramit Manna +2 more | 2023-08-08 |
| 11699585 | Methods of forming hardmasks | Jui-Yuan Hsu, Pramit Manna, Karthik Janakiraman | 2023-07-11 |
| 11545376 | Plasma parameters and skew characterization by high speed imaging | Sidharth Bhatia, Edward P. Hammond, IV, Anup K. Singh, Vivek Shah, Ganesh Balasubramanian | 2023-01-03 |
| 11515191 | Graded dimple height pattern on heater for lower backside damage and low chucking voltage | Vivek Shah, Ganesh Balasubramanian | 2022-11-29 |
| 11495440 | Plasma density control on substrate edge | Prashanth Kothnur, Sidharth Bhatia, Anup K. Singh, Vivek Shah, Ganesh Balasubramanian +1 more | 2022-11-08 |
| 11488811 | Chucking process and system for substrate processing chambers | Ganesh Balasubramanian, Vivek Shah, Jiheng Zhao | 2022-11-01 |
| 11120976 | Apparatus and methods for removing contaminant particles in a plasma process | Anup K. Singh, Vivek Shah, Sidharth Bhatia, Ganesh Balasubramanian | 2021-09-14 |
| 11069514 | Remote capacitively coupled plasma source with improved ion blocker | Vivek Shah, Vinayak Vishwanath Hassan, Ganesh Balasubramanian | 2021-07-20 |
| 10892143 | Technique to prevent aluminum fluoride build up on the heater | Vivek Shah, Anup K. Singh, Ganesh Balasubramanian | 2021-01-12 |
| 10790121 | Plasma density control on substrate edge | Prashanth Kothnur, Sidharth Bhatia, Anup K. Singh, Vivek Shah, Ganesh Balasubramanian +1 more | 2020-09-29 |
| 10748797 | Plasma parameters and skew characterization by high speed imaging | Sidharth Bhatia, Edward P. Hammond, IV, Anup K. Singh, Vivek Shah, Ganesh Balasubramanian | 2020-08-18 |
| 10714319 | Apparatus and methods for removing contaminant particles in a plasma process | Anup K. Singh, Vivek Shah, Sidharth Bhatia, Ganesh Balasubramanian | 2020-07-14 |
| 10688538 | Aluminum fluoride mitigation by plasma treatment | Vivek Shah, Anup K. Singh, Ganesh Balasubramanian, Bok Hoen Kim | 2020-06-23 |
| 10074559 | Selective poreseal deposition prevention and residue removal using SAM | Geetika Bajaj, Tapash Chakraborty, Prerna Goradia, Robert Jan Visser, Deenesh Padhi | 2018-09-11 |
| 9793108 | Interconnect integration for sidewall pore seal and via cleanliness | He Ren, Mehul Naik, Deenesh Padhi, Priyanka DASH, Alexandros T. Demos | 2017-10-17 |
| 9780223 | Gallium arsenide based materials used in thin film transistor applications | Kaushal K. Singh, Robert Jan Visser | 2017-10-03 |
| 9646876 | Aluminum nitride barrier layer | Deenesh Padhi, Srinivas Guggilla, Alexandros T. Demos, He Ren, Priyanka DASH | 2017-05-09 |
| 9252392 | Thin film encapsulation-thin ultra high barrier layer for OLED application | Dieter Haas | 2016-02-02 |
| 8895842 | High quality TCO-silicon interface contact structure for high efficiency thin film silicon solar cells | Shuran Sheng, Yong Kee Chae, Stefan Klein, Amir Al-Bayati | 2014-11-25 |