Issued Patents All Time
Showing 26–50 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062942 | Methods for controllable metal and barrier-liner recess | He Ren, Amrita B. Mullick, Regina Freed, Uday Mitra | 2021-07-13 |
| 11043415 | Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping | Zhiyuan Wu, Nikolaos Bekiaris, Jin-Hee Park, Mark Lee | 2021-06-22 |
| 10957533 | Methods for etching a structure for semiconductor applications | Hao Jiang, He Ren, Hao Chen | 2021-03-23 |
| 10930472 | Methods for forming a metal silicide interconnection nanowire structure | Bencherki Mebarki, Annamalai Lakshmanan, Kaushal K. Singh, Andrew Cockburn, Ludovic Godet +1 more | 2021-02-23 |
| 10916433 | Methods of forming metal silicide layers and metal silicide layers formed therefrom | He Ren, Maximillian Clemons, Mei-Yee Shek, Minrui Yu, Bencherki Mebarki +2 more | 2021-02-09 |
| 10847463 | Seed layers for copper interconnects | Zhiyuan Wu, Meng Chu Tseng, Ben-Li Sheu | 2020-11-24 |
| 10727119 | Process integration approach of selective tungsten via fill | He Ren, Feiyue Ma, Yu Lei, Kai Wu, Zhiyuan Wu +2 more | 2020-07-28 |
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, David Thompson +6 more | 2020-07-07 |
| 10692759 | Methods for manufacturing an interconnect structure for semiconductor devices | Hao Jiang, He Ren, Hao Chen | 2020-06-23 |
| 10685849 | Damage free metal conductor formation | He Ren, Jong Mun Kim, Maximillian Clemons, Minrui Yu, Chentsau Chris Ying | 2020-06-16 |
| 10651043 | Process integration method to tune resistivity of nickel silicide | He Ren, Minrui Yu | 2020-05-12 |
| 10643895 | Self-aligned interconnects formed using subtractive techniques | Bencherki Mebarki, Huixiong Dai, Yongmei Chen, He Ren | 2020-05-05 |
| 10636704 | Seam-healing method upon supra-atmospheric process in diffusion promoting ambient | Bencherki Mebarki, Sean S. Kang, Keith Tatseun Wong, He Ren, Ellie Yieh +1 more | 2020-04-28 |
| 10593592 | Laminate and core shell formation of silicide nanowire | Bencherki Mebarki, Annamalai Lakshmanan, Kaushal K. Singh, Paul F. Ma, Andrew Cockburn +1 more | 2020-03-17 |
| 10566188 | Method to improve film stability | Maximillian Clemons, Michel R. Frei, Mahendra Pakala, Srinivas D. Nemani, Ellie Yieh | 2020-02-18 |
| 10546742 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Yong Cao, Yana Cheng, Weifeng YE | 2020-01-28 |
| 10438849 | Microwave anneal to improve CVD metal gap-fill and throughput | He Ren, Jie Zhou, Guannan Chen, Michael W. Stowell, Bencherki Mebarki +3 more | 2019-10-08 |
| 10410918 | Enhanced cobalt agglomeration resistance and gap-fill performance by ruthenium doping | Zhiyuan Wu, Nikolaos Bekiaris, Jin-Hee Park, Mark Lee | 2019-09-10 |
| 10388533 | Process integration method to tune resistivity of nickel silicide | He Ren, Minrui Yu | 2019-08-20 |
| 10256144 | Process integration approach of selective tungsten via fill | He Ren, Feiyue Ma, Yu Lei, Kai Wu, Zhiyuan Wu +2 more | 2019-04-09 |
| 10204764 | Methods for forming a metal silicide interconnection nanowire structure | Bencherki Mebarki, Annamalai Lakshmanan, Kaushal K. Singh, Andrew Cockburn, Ludovic Godet +1 more | 2019-02-12 |
| 10170299 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Yong Cao, Yana Cheng, Weifeng YE | 2019-01-01 |
| 10113234 | UV assisted silylation for porous low-k film sealing | Bo Xie, Alexandros T. Demos, Vu Ngoc Tran Nguyen, Kelvin Chan, He Ren +1 more | 2018-10-30 |
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, David Thompson +6 more | 2018-10-23 |
| 10062607 | Methods for producing interconnects in semiconductor devices | Ismail Emesh, Roey Shaviv | 2018-08-28 |