Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847463 | Seed layers for copper interconnects | Zhiyuan Wu, Mehul Naik, Ben-Li Sheu | 2020-11-24 |
| 6193813 | Utilization of SiH4 soak and purge in deposition processes | Mei Chang, Ramanujapuram A. Srinivas, Klaus-Dieter Rinnen, Moshe Eizenberg, Susan Telford | 2001-02-27 |
| 5997950 | Substrate having uniform tungsten silicide film and method of manufacture | Susan G. Telford, Michio Aruga, Klaus-Dieter Rinnen | 1999-12-07 |
| 5817576 | Utilization of SiH.sub.4 soak and purge in deposition processes | Mei Chang, Ramanujapuram A. Srinivas, Klaus-Dieter Rinnen, Moshe Eizenberg, Susan Telford | 1998-10-06 |
| 5643633 | Uniform tungsten silicide films produced by chemical vapor depostiton | Susan G. Telford, Michio Aruga, Moshe Eizenberg | 1997-07-01 |
| 5565382 | Process for forming tungsten silicide on semiconductor wafer using dichlorosilane gas | Susan Telford, Mei Chang | 1996-10-15 |
| 5558910 | Uniform tungsten silicide films produced by chemical vapor deposition | Susan G. Telford, Michio Aruga, Moshe Eizenberg | 1996-09-24 |
| 5500249 | Uniform tungsten silicide films produced by chemical vapor deposition | Susan G. Telford, Michio Aruga | 1996-03-19 |
| 5326725 | Clamping ring and susceptor therefor | Semyon Sherstinsky, Charles C. Harris, Mei Chang, Dale R. Du Bois, James Roberts +3 more | 1994-07-05 |