Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049927 | Seam-healing method upon supra-atmospheric process in diffusion promoting ambient | Bencherki Mebarki, Sean S. Kang, Keith Tatseun Wong, He Ren, Ellie Yieh +1 more | 2018-08-14 |
| 10008448 | Dielectric/metal barrier integration to prevent copper diffusion | He Ren, Yong Cao, Mei-Yee Shek | 2018-06-26 |
| 10002834 | Method and apparatus for protecting metal interconnect from halogen based precursors | Paul F. Ma, Tae Hong Ha, Srinivas Guggilla | 2018-06-19 |
| 9865466 | Silicide phase control by confinement | Bencherki Mebarki, Ellie Yieh, Srinivas D. Nemani | 2018-01-09 |
| 9847289 | Protective via cap for improved interconnect performance | Paul F. Ma, Srinivas D. Nemani | 2017-12-19 |
| 9847252 | Methods for forming 2-dimensional self-aligned vias | Bencherki Mebarki, Srinivas D. Nemani | 2017-12-19 |
| 9793108 | Interconnect integration for sidewall pore seal and via cleanliness | He Ren, Deenesh Padhi, Priyanka DASH, Bhaskar Kumar, Alexandros T. Demos | 2017-10-17 |
| 9761489 | Self-aligned interconnects formed using substractive techniques | Bencherki Mebarki, Huixiong Dai, Yongmei Chen, He Ren | 2017-09-12 |
| 9711397 | Cobalt resistance recovery by hydrogen anneal | Nikolaos Bekiaris, Zhiyuan Wu | 2017-07-18 |
| 9640424 | Integrated metal spacer and air gap interconnect | He Ren | 2017-05-02 |
| 9613859 | Direct deposition of nickel silicide nanowire | Annamalai Lakshmanan, Bencherki Mebarki, Kaushal K. Singh, Paul F. Ma, Andrew Cockburn +1 more | 2017-04-04 |
| 9601431 | Dielectric/metal barrier integration to prevent copper diffusion | He Ren, Yong Cao, Mei-Yee Shek, Yana Cheng, Sree Rangasai V. Kesapragada | 2017-03-21 |
| 9570345 | Cobalt resistance recovery by hydrogen anneal | Nikolaos Bekiaris, Zhiyuan Wu | 2017-02-14 |
| 9514953 | Methods for barrier layer removal | Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, He Ren | 2016-12-06 |
| 9508561 | Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications | Srinivas D. Nemani, Takehito Koshizawa, He Ren | 2016-11-29 |
| 9437479 | Methods for forming an interconnect pattern on a substrate | Suketu Arun Parikh | 2016-09-06 |
| 9425092 | Methods for producing interconnects in semiconductor devices | Ismail Emesh, Roey Shaviv | 2016-08-23 |
| 9368448 | Metal-containing films as dielectric capping barrier for advanced interconnects | Yihong Chen, Abhijit Basu Mallick, Srinivas D. Nemani | 2016-06-14 |
| 9337051 | Method for critical dimension reduction using conformal carbon films | Bencherki Mebarki, Bok Hoen Kim, Deenesh Padhi, Li Yan Miao, Pramit Manna +4 more | 2016-05-10 |
| 9318383 | Integrated cluster to enable next generation interconnect | Abhijit Basu Mallick, Kiran V. Thadani, Zhenjiang Cui | 2016-04-19 |
| 9312168 | Air gap structure integration using a processing system | He Ren, Zhenjiang Cui | 2016-04-12 |
| 9305831 | Integrated metal spacer and air gap interconnect | He Ren | 2016-04-05 |
| 9299577 | Methods for etching a dielectric barrier layer in a dual damascene structure | He Ren, Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani | 2016-03-29 |
| 9299605 | Methods for forming passivation protection for an interconnection structure | He Ren, Yong Cao, Sree Rangasai V. Kesapragada, Mei-Yee Shek, Yana Cheng | 2016-03-29 |
| 9269563 | Methods for forming interconnect structure utilizing selective protection process for hardmask removal process | He Ren | 2016-02-23 |