| 9896326 |
FCVD line bending resolution by deposition modulation |
Jingmei Liang, Jessica S. Kachian, Nagarajan Rajagopalan |
2018-02-20 |
| 9583332 |
Low temperature cure modulus enhancement |
Pramit Manna, Abhijit Basu Mallick |
2017-02-28 |
| 9412581 |
Low-K dielectric gapfill by flowable deposition |
Jingmei Liang, Young S. Lee, Mukund Srinivasan |
2016-08-09 |
| 9362107 |
Flowable low-k dielectric gapfill treatment |
Abhijit Basu Mallick, Sanjay Kamath |
2016-06-07 |
| 9318383 |
Integrated cluster to enable next generation interconnect |
Mehul Naik, Abhijit Basu Mallick, Zhenjiang Cui |
2016-04-19 |
| 9184093 |
Integrated cluster to enable next generation interconnect |
Mehul Naik, Abhijit Basu Mallick, Zhenjiang Cui |
2015-11-10 |
| 8921235 |
Controlled air gap formation |
Jingjing Xu, Abhijit Basu Mallick, Joe Griffith Cruz, Nitin K. Ingle, Pravin K. Narwankar |
2014-12-30 |
| 8889566 |
Low cost flowable dielectric films |
Amit Chatterjee, Abhijit Basu Mallick, Nitin K. Ingle, Brian Saxton Underwood, Xiaolin Chen +2 more |
2014-11-18 |
| 8475674 |
High-temperature selective dry etch having reduced post-etch solid residue |
Jing Tang, Nitin K. Ingle, Dongqing Yang |
2013-07-02 |
