Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418858 | Selective etch of silicon by way of metastable hydrogen termination | Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2016-08-16 |
| 9412581 | Low-K dielectric gapfill by flowable deposition | Kiran V. Thadani, Jingmei Liang, Mukund Srinivasan | 2016-08-09 |
| 9236266 | Dry-etch for silicon-and-carbon-containing films | Jingchun Zhang, Anchuan Wang, Nitin K. Ingle, Yunyu Wang | 2016-01-12 |
| 9093390 | Conformal oxide dry etch | Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2015-07-28 |
| 9064816 | Dry-etch for selective oxidation removal | Sang Hyuk Kim, Dongqing Yang, Weon Young Jung, Sang Jin Kim, Ching-Mei Hsu +2 more | 2015-06-23 |
| 8808563 | Selective etch of silicon by way of metastable hydrogen termination | Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2014-08-19 |
| 8801952 | Conformal oxide dry etch | Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2014-08-12 |
| 8771536 | Dry-etch for silicon-and-carbon-containing films | Jingchun Zhang, Anchuan Wang, Nitin K. Ingle, Yunyu Wang | 2014-07-08 |
| 8679982 | Selective suppression of dry-etch rate of materials containing both silicon and oxygen | Yunyu Wang, Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2014-03-25 |
| 8679983 | Selective suppression of dry-etch rate of materials containing both silicon and nitrogen | Yunyu Wang, Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2014-03-25 |
| 8642481 | Dry-etch for silicon-and-nitrogen-containing films | Yunyu Wang, Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2014-02-04 |
| 8541312 | Selective suppression of dry-etch rate of materials containing both silicon and nitrogen | Yunyu Wang, Anchuan Wang, Jingchun Zhang, Nitin K. Ingle | 2013-09-24 |
| 8497211 | Integrated process modulation for PSG gapfill | Anchuan Wang, Lan Chia Chan, Shankar Venkataraman | 2013-07-30 |
| 8450191 | Polysilicon films by HDP-CVD | Anchuan Wang, Xiaolin Chen | 2013-05-28 |
| 8414747 | High-throughput HDP-CVD processes for advanced gapfill applications | Bo Qi | 2013-04-09 |
| 7989366 | Dopant activation in doped semiconductor substrates | Jeffrey C. Munro, Srinivas D. Nemani, Marlon Edward Menezes, Christopher Dennis Bencher, Vijay Parihar | 2011-08-02 |
| 7972968 | High density plasma gapfill deposition-etch-deposition process etchant | Ying Rui, Dmitry Lubomirsky, Daniel J. Hoffman, Jang-Gyoo Yang, Anchuan Wang | 2011-07-05 |
| 7967913 | Remote plasma clean process with cycled high and low pressure clean steps | Zhong Qiang Hua, Sanjay Kamath, Ellie Yieh, Hien Minh Le, Anjana M. Patel +1 more | 2011-06-28 |
| 7910491 | Gapfill improvement with low etch rate dielectric liners | Young Soo Kwon, Bi Jang, Anchuan Wang, Mihaela Balseanu, Li-Qun Xia +1 more | 2011-03-22 |
| 7867921 | Reduction of etch-rate drift in HDP processes | Anchuan Wang, Manoj Vellaikal, Jason Bloking, Jin-Ho Jeon, Hemant P. Mungekar | 2011-01-11 |
| 7811411 | Thermal management of inductively coupled plasma reactors | Siqing Lu, Qiwei Liang, Irene Chou, Steven H. Kim, Ellie Yieh +1 more | 2010-10-12 |
| 7799704 | Gas baffle and distributor for semiconductor processing chamber | Soonam Park, Farhan Ahmad, Hemant P. Mungekar, Sanjay Kamath, Siqing Lu | 2010-09-21 |
| 7766510 | Cooling structure for street lamp using light emitting diode | — | 2010-08-03 |
| 7745350 | Impurity control in HDP-CVD DEP/ETCH/DEP processes | Anchuan Wang, Manoj Vellaikal, Jason Bloking, Jin-Ho Jeon, Hemant P. Mungekar | 2010-06-29 |
| 7740706 | Gas baffle and distributor for semiconductor processing chamber | Soonam Park, Farhan Ahmad, Hemant P. Mungekar, Sanjay Kamath, Siqing Lu | 2010-06-22 |