Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189484 | Semiconductor nitridation passivation | Russell A. Benson, Silvia Borsari, Vinay Nair, Somik Mukherjee | 2021-11-30 |
| 11011378 | Atom implantation for reduction of compressive stress | Yiping Wang, Caizhi Xu, Pengyuan Zheng, Russell A. Benson, Yongjun Jeff Hu +1 more | 2021-05-18 |
| 10971500 | Methods used in the fabrication of integrated circuitry | Tong Liu, Yi Fang Lee, Davide Colombo, Silvia Borsari, Austin Johnson | 2021-04-06 |
| 10648074 | Physical vapor deposition with isotropic neutral and non-isotropic ion velocity distribution at the wafer surface | Daniel J. Hoffman, Karl M. Brown, John Pipitone | 2020-05-12 |
| 10400328 | Physical vapor deposition system with a source of isotropic ion velocity distribution at the wafer surface | Daniel J. Hoffman, Karl M. Brown, John Pipitone | 2019-09-03 |
| 9856558 | Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface | Daniel J. Hoffman, Karl M. Brown, John Pipitone | 2018-01-02 |
| 9593411 | Physical vapor deposition chamber with capacitive tuning at wafer support | Daniel J. Hoffman, Karl M. Brown, John Pipitone | 2017-03-14 |
| 8563428 | Methods for depositing metal in high aspect ratio features | Karl M. Brown, Alan A. Ritchie, John Pipitone, Daniel J. Hoffman | 2013-10-22 |
| 8329593 | Method and apparatus for removing polymer from the wafer backside and edge | Imad Yousif, Anchel Sheyner, Ajit Balakrishna, Nancy Fung, Martin Jeffrey Salinas +2 more | 2012-12-11 |
| 8092605 | Magnetic confinement of a plasma | Steven C. Shannon, Masao Drexel, James A. Stinnett, Ying Xiao, Roger Alan Lindley +1 more | 2012-01-10 |
| 8070925 | Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target | Daniel J. Hoffman, Karl M. Brown, John Pipitone, Lara Hawrylchak | 2011-12-06 |
| 7972968 | High density plasma gapfill deposition-etch-deposition process etchant | Young S. Lee, Dmitry Lubomirsky, Daniel J. Hoffman, Jang-Gyoo Yang, Anchuan Wang | 2011-07-05 |
| 7967996 | Process for wafer backside polymer removal and wafer front side photoresist removal | Kenneth S. Collins, Hiroji Hanawa, Andrew Nguyen, Shahid Rauf, Ajit Balakrishna +6 more | 2011-06-28 |
| 7879183 | Apparatus and method for front side protection during backside cleaning | Imad Yousif, Nancy Fung, Martin Jeffrey Salinas, Ajit Balakrishna, Anchel Sheyner +2 more | 2011-02-01 |
| 7320942 | Method for removal of metallic residue after plasma etching of a metal layer | Xiaoyi Chen, Chentsau Ying, Padmapani Nallan, Ajay Kumar, Ralph Kerns +3 more | 2008-01-22 |