Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12428731 | Flow guide structures and heat shield structures, and related methods, for deposition uniformity and process adjustability | Zuoming ZHU, Ala Moradian, Shu-Kwan LAU, John Tolle, Manjunath Subbanna +3 more | 2025-09-30 |
| 12428753 | Lift assemblies, and related methods and components, for substrate processing chambers | Aniketnitin PATIL, Raja Murali DHAMODHARAN, Shu-Kwan LAU | 2025-09-30 |
| 12334318 | Plasma preclean system for cluster tool | Songjae Lee, Masato Ishii, Martin TRUEMPER, Richard O. Collins, Yong ZHENG +5 more | 2025-06-17 |
| 12325914 | Precursor delivery system and method for cyclic deposition | Miguel Saldana, Victor Calderon | 2025-06-10 |
| 12243761 | Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging | Zhepeng CONG, Hui Chen, Xinning LUAN, Ashur J. ATANOS | 2025-03-04 |
| 12094715 | Abatement and strip process chamber in a load lock configuration | Paul B. Reuter, Andrew Nguyen, Jared Ahmad Lee | 2024-09-17 |
| 11965241 | Cluster tools, systems, and methods having one or more pressure stabilization chambers | Saurabh Chopra, Masato Ishii, Sheng-Chen Twan, Srividya Natarajan | 2024-04-23 |
| 11574831 | Method and apparatus for substrate transfer and radical confinement | Jared Ahmad Lee, Paul B. Reuter, Imad Yousif, Aniruddha Pal | 2023-02-07 |
| 11177136 | Abatement and strip process chamber in a dual loadlock configuration | Jared Ahmad Lee, Paul B. Reuter, Imad Yousif, Aniruddha Pal | 2021-11-16 |
| 11171008 | Abatement and strip process chamber in a dual load lock configuration | Jared Ahmad Lee, Paul B. Reuter, Imad Yousif, Aniruddha Pal | 2021-11-09 |
| 10991552 | Cooling mechanism utilized in a plasma reactor with enhanced temperature regulation | Aniruddha Pal, Victor Calderon, Valentin N. Todorow | 2021-04-27 |
| 10943788 | Abatement and strip process chamber in a load lock configuration | Paul B. Reuter, Andrew Nguyen, Jared Ahmad Lee | 2021-03-09 |
| 10566205 | Abatement and strip process chamber in a load lock configuration | Paul B. Reuter, Andrew Nguyen, Jared Ahmad Lee | 2020-02-18 |
| 10453694 | Abatement and strip process chamber in a dual loadlock configuration | Jared Ahmad Lee, Paul B. Reuter, Imad Yousif, Aniruddha Pal | 2019-10-22 |
| 10249475 | Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation | Aniruddha Pal, Victor Calderon, Valentin N. Todorow | 2019-04-02 |
| 10204805 | Thin heated substrate support | Imad Yousif, Paul B. Reuter, Aniruddha Pal, Jared Ahmad Lee | 2019-02-12 |
| 10090181 | Method and apparatus for substrate transfer and radical confinement | Jared Ahmad Lee, Paul B. Reuter, Imad Yousif, Aniruddha Pal | 2018-10-02 |
| 9947559 | Thermal management of edge ring in semiconductor processing | Aniruddha Pal, Dmitry Lubomirsky, Imad Yousif, Andrew Nguyen | 2018-04-17 |
| 9885567 | Substrate placement detection in semiconductor equipment using thermal response characteristics | Jared Ahmad Lee, Yi Zhou, Changhun Lee | 2018-02-06 |
| 9587789 | Methods and apparatus for providing a gas mixture to a pair of process chambers | Jared Ahmad Lee, Ezra Robert Gold, James P. Cruse | 2017-03-07 |
| 9464732 | Apparatus for uniform pumping within a substrate process chamber | Paul B. Reuter, Jared Ahmad Lee, Imad Yousif | 2016-10-11 |
| 9330887 | Plasma reactor with tiltable overhead RF inductive source | Kenneth S. Collins, Andrew Nguyen, Imad Yousif, Ming Xu | 2016-05-03 |
| 8414736 | Plasma reactor with tiltable overhead RF inductive source | Kenneth S. Collins, Andrew Nguyen, Imad Yousif, Ming Xu | 2013-04-09 |
| 8329593 | Method and apparatus for removing polymer from the wafer backside and edge | Imad Yousif, Anchel Sheyner, Ajit Balakrishna, Nancy Fung, Ying Rui +2 more | 2012-12-11 |
| 8074677 | Method and apparatus for controlling gas flow to a processing chamber | Ezra Robert Gold, Richard Fovell, James P. Cruse, Jared Ahmad Lee, Bruno Geoffrion +1 more | 2011-12-13 |