Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12325914 | Precursor delivery system and method for cyclic deposition | Martin Jeffrey Salinas, Victor Calderon | 2025-06-10 |
| 11459654 | Liquid precursor injection for thin film deposition | Alex Finkelman, Niloy Mukherjee | 2022-10-04 |
| 10544519 | Method and apparatus for surface preparation prior to epitaxial deposition | Stephen E. Savas, Dan Cossentine, Hae Young Kim, Subramanian Tamilmani, Niloy Mukherjee +1 more | 2020-01-28 |
| D803283 | Wafer handling assembly | Yuliy Rashkovsky, Brett Stuart Snowden | 2017-11-21 |
| 8845856 | Edge ring assembly for plasma etching chambers | Michael Kang, Michael C. Kellogg, Travis R. Taylor | 2014-09-30 |
| 8671965 | Methods for enhanced fluid delivery on bevel etch applications | Greg Sexton | 2014-03-18 |
| 8328980 | Apparatus and methods for enhanced fluid delivery on bevel etch applications | Greg Sexton | 2012-12-11 |
| 7481695 | Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head | Damon Vincent Williams | 2009-01-27 |
| 7025854 | Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system | John M. Boyd, Aleksander Owczarz | 2006-04-11 |
| 7018273 | Platen with diaphragm and method for optimizing wafer polishing | Adrian Kiermasz | 2006-03-28 |
| 6909935 | Methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer | — | 2005-06-21 |
| 6902466 | Oscillating chemical mechanical planarization apparatus | Aleksander Owczarz | 2005-06-07 |
| 6843707 | Methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing | Damon Vincent Williams | 2005-01-18 |
| 6752703 | Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film | John M. Boyd, Damon Vincent Williams | 2004-06-22 |
| 6725120 | Apparatus and methods with resolution enhancement feature for improving accuracy of conversion of required chemical mechanical polishing pressure to force to be applied by polishing head to wafer | — | 2004-04-20 |
| 6719874 | Active retaining ring support | Yehiel Gotkis, Aleksander Owczarz, David Wei, Damon Vincent Williams | 2004-04-13 |
| 6709322 | Apparatus for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing | Damon Vincent Williams | 2004-03-23 |
| 6640155 | Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head | Damon Vincent Williams | 2003-10-28 |
| 6585572 | Subaperture chemical mechanical polishing system | John M. Boyd, Yehiel Gotkis, Aleksander Owczarz | 2003-07-01 |
| 6579407 | Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system | John M. Boyd, Aleksander Owczarz | 2003-06-17 |
| 6561870 | Adjustable force applying air platen and spindle system, and methods for using the same | Aleksander Owczarz | 2003-05-13 |
| 6520833 | Oscillating fixed abrasive CMP system and methods for implementing the same | Aleksander Owczarz | 2003-02-18 |
| 6083082 | Spindle assembly for force controlled polishing | — | 2000-07-04 |