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System and method to divide fluid flow in a predetermined ratio |
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Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone |
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Method and apparatus for controlling gas flow to a processing chamber |
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Method and apparatus for controlling gas flow to a processing chamber |
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Method and apparatus for controlling gas flow to a processing chamber |
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Gas distribution system for improved transient phase deposition |
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Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content |
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| 7541292 |
Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones |
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Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation |
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2008-10-07 |
| 7189639 |
Use of germanium dioxide and/or alloys of GeO2 with silicon dioxide for semiconductor dielectric applications |
Padmanabhan Krishnaraj, Michael S. Cox, Srinivas D. Nemani |
2007-03-13 |
| 7064077 |
Method for high aspect ratio HDP CVD gapfill |
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2006-06-20 |
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HDP-CVD uniformity control |
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Method for high aspect ratio HDP CVD gapfill |
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