Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10648074 | Physical vapor deposition with isotropic neutral and non-isotropic ion velocity distribution at the wafer surface | Daniel J. Hoffman, Karl M. Brown, Ying Rui | 2020-05-12 |
| 10400328 | Physical vapor deposition system with a source of isotropic ion velocity distribution at the wafer surface | Daniel J. Hoffman, Karl M. Brown, Ying Rui | 2019-09-03 |
| 9856558 | Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface | Daniel J. Hoffman, Karl M. Brown, Ying Rui | 2018-01-02 |
| 9593411 | Physical vapor deposition chamber with capacitive tuning at wafer support | Daniel J. Hoffman, Karl M. Brown, Ying Rui | 2017-03-14 |
| 9017533 | Apparatus for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning | John C. Forster, Daniel J. Hoffman, Xianmin Tang, Rongjun Wang | 2015-04-28 |
| 8920611 | Method for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning | John C. Forster, Daniel J. Hoffman, Xianming Tang, Rongjun Wang | 2014-12-30 |
| 8846451 | Methods for depositing metal in high aspect ratio features | Alan A. Ritchie, Karl M. Brown | 2014-09-30 |
| 8562798 | Physical vapor deposition plasma reactor with RF source power applied to the target and having a magnetron | Karl M. Brown, Vineet Haresh Mehta | 2013-10-22 |
| 8563428 | Methods for depositing metal in high aspect ratio features | Karl M. Brown, Alan A. Ritchie, Ying Rui, Daniel J. Hoffman | 2013-10-22 |
| 8512526 | Method of performing physical vapor deposition with RF plasma source power applied to the target using a magnetron | Karl M. Brown, Vineet Haresh Mehta | 2013-08-20 |
| 8491759 | RF impedance matching network with secondary frequency and sub-harmonic variant | Gerald E. Boston | 2013-07-23 |
| 8435379 | Substrate cleaning chamber and cleaning and conditioning methods | Vineet Haresh Mehta, Karl M. Brown, Daniel J. Hoffman, Steven C. Shannon, Keith A. Miller +1 more | 2013-05-07 |
| 8123969 | Process for removing high stressed film using LF or HF bias power and capacitively coupled VHF source power with enhanced residue capture | Karl M. Brown, Vineet Haresh Mehta | 2012-02-28 |
| 8070925 | Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target | Daniel J. Hoffman, Ying Rui, Karl M. Brown, Lara Hawrylchak | 2011-12-06 |
| 8062484 | Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target | Karl M. Brown, Vineet Haresh Mehta | 2011-11-22 |
| 7820020 | Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas | Karl M. Brown, Vineet Haresh Mehta, Ralf Hofmann | 2010-10-26 |
| 7804040 | Physical vapor deposition plasma reactor with arcing suppression | Karl M. Brown, Semyon Sherstinksy, Vineet Haresh Mehta, Wei Wang, Kurt J. Ahmann +1 more | 2010-09-28 |
| 7780814 | Wafer pre-clean reactor cable termination for selective suppression/reflection of source and bias frequency cross products | Kenneth Smyth, Mei Po (Mabel) Yeung | 2010-08-24 |
| 7768269 | Method of multi-location ARC sensing with adaptive threshold comparison | Ryan Nunn-Gage | 2010-08-03 |
| 7750644 | System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating | Ryan Nunn-Gage | 2010-07-06 |
| 7750645 | Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation | Ryan Nunn-Gage | 2010-07-06 |
| 7737702 | Apparatus for wafer level arc detection at an electrostatic chuck electrode | — | 2010-06-15 |
| 7733095 | Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode | John C. Forster | 2010-06-08 |
| 7541289 | Process for removing high stressed film using LF or HF bias power and capacitively coupled VHF source power with enhanced residue capture | Karl M. Brown, Vineet Haresh Mehta | 2009-06-02 |
| 7399943 | Apparatus for metal plasma vapor deposition and re-sputter with source and bias power frequencies applied through the workpiece | Karl M. Brown, Vineet Haresh Mehta | 2008-07-15 |