JW

Jerry Wong

Applied Materials: 22 patents #582 of 7,310Top 8%
AT Applied Komatsu Technology: 2 patents #20 of 62Top 35%
GT Gamma Precision Technology: 2 patents #2 of 4Top 50%
SO Sony: 1 patents #17,262 of 25,231Top 70%
Overall (All Time): #148,012 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 25 most recent of 27 patents

Patent #TitleCo-InventorsDate
6545420 Plasma reactor using inductive RF coupling, and processes Kenneth S. Collins, Craig A. Roderick, John Trow, Chan-Lon Yang, Jeffrey Marks +6 more 2003-04-08
6518195 Plasma reactor using inductive RF coupling, and processes Kenneth S. Collins, Chan-Lon Yang, Jeffrey Marks, Peter Keswick, David W. Groechel +7 more 2003-02-11
6488807 Magnetic confinement in a plasma reactor having an RF bias electrode Kenneth S. Collins, Chan-Lon Yang, Jeffrey Marks, Peter Keswick, David W. Groechel +7 more 2002-12-03
6444137 Method for processing substrates using gaseous silicon scavenger Kenneth S. Collins, Chan-Lon Yang, Jeffrey Marks, Peter Keswick, David W. Groechel 2002-09-03
6399514 High temperature silicon surface providing high selectivity in an oxide etch process Jeffrey Marks, David W. Groechel, Peter Keswick, Chan-Lon Yang 2002-06-04
6352937 Method for stripping organic based film Shingo Kadomura, Masato Toshima 2002-03-05
6251792 Plasma etch processes Kenneth S. Collins, Craig A. Roderick, John Trow, Chan-Lon Yang, Jeffrey Marks +7 more 2001-06-26
6171974 High selectivity oxide etch process for integrated circuit structures Jeffrey Marks, David W. Groechel, Peter Keswick, Chan-Lon Yang 2001-01-09
6068784 Process used in an RF coupled plasma reactor Kenneth S. Collins, Craig A. Roderick, John Trow, Chan-Lon Yang, Jeffrey Marks +6 more 2000-05-30
6024826 Plasma reactor with heated source of a polymer-hardening precursor material Kenneth S. Collins, Michael R. Rice, David W. Groechel, Gerald Yin, Jon Mohn +5 more 2000-02-15
6020270 Bomine and iodine etch process for silicon and silicides David N. Wang, Mei Chang, Alfred Mak, Dan Maydan 2000-02-01
5990017 Plasma reactor with heated source of a polymer-hardening precursor material Kenneth S. Collins, Michael R. Rice, David W. Groechel, Gerald Yin, Jon Mohn +5 more 1999-11-23
5895549 Method and apparatus for etching film layers on large substrates Haruhiro Harry Goto, Junichi Fujimoto 1999-04-20
5888414 Plasma reactor and processes using RF inductive coupling and scavenger temperature control Kenneth S. Collins, Chan-Lon Yang, Jeffrey Marks, Peter Keswick, David W. Groechel 1999-03-30
5874362 Bromine and iodine etch process for silicon and silicides David N. Wang, Mei Chang, Alfred Mak, Dan Maydan 1999-02-23
5753133 Method and apparatus for etching film layers on large substrates Masato Toshima, Kam S. Law, Dan Maydan, Norman L. Turner 1998-05-19
5585729 Fluid concentration detecting apparatus Masato Toshima, Hiroji Hanawa 1996-12-17
5556501 Silicon scavenger in an inductively coupled RF plasma reactor Kenneth S. Collins, Craig A. Roderick, John Trow, Chan-Lon Yang, Jeffrey Marks +7 more 1996-09-17
5308417 Uniformity for magnetically enhanced plasma chambers David W. Groechel, Masato Toshima, Robert Steger, Tetsuya Ishikawa, Regga Tekeste +2 more 1994-05-03
5288645 Hydrogen evolution analyzer Masato Toshima 1994-02-22
5215619 Magnetic field-enhanced plasma etch reactor David Cheng, Dan Maydan, Sasson Somekh, Kenneth R. Stalder, Dana L. Andrews +4 more 1993-06-01
5176790 Process for forming a via in an integrated circuit structure by etching through an insulation layer while inhibiting sputtering of underlying metal Paul Arleo, Jon Henri, Graham W. Hills, Robert Wu 1993-01-05
5158644 Reactor chamber self-cleaning process David Cheung, Peter Keswick 1992-10-27
5129958 Cleaning method for semiconductor wafer processing apparatus Makoto Nagashima, Naoaki Kobayashi 1992-07-14
4960488 Reactor chamber self-cleaning process Kam S. Law, Cissy Leung, Ching Chiang Tang, Kenneth S. Collins, Mei Chang +1 more 1990-10-02