Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6217786 | Mechanism for bow reduction and critical dimension control in etching silicon dioxide using hydrogen-containing additive gases in fluorocarbon gas chemistry | Thomas D. Nguyen, Douglas Keil, Keyvan Khajehnouri | 2001-04-17 |
| 6125788 | Plasma reactor with enhanced plasma uniformity by gas addition, reduced chamber diameter and reduced RF wafer pedestal diameter | Yuh-Jia Su | 2000-10-03 |
| 5913148 | Reduced size etching method for integrated circuits | — | 1999-06-15 |
| 5744049 | Plasma reactor with enhanced plasma uniformity by gas addition, and method of using same | Yuh-Jia Su | 1998-04-28 |
| 5685914 | Focus ring for semiconductor wafer processing in a plasma reactor | Yuh-Jia Su, Yoshiaki Tanase, Robert E. Ryan | 1997-11-11 |
| 5534108 | Method and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactor | Xue-Yu Qian, Gerald Yin, Robert Steger | 1996-07-09 |
| 5410122 | Use of electrostatic forces to reduce particle contamination in semiconductor plasma processing chambers | Yuh-Jia Su, Anand Gupta, Joseph Lanucha | 1995-04-25 |
| 5382316 | Process for simultaneous removal of photoresist and polysilicon/polycide etch residues from an integrated circuit structure | Ruth E. Bucknall | 1995-01-17 |
| 5242538 | Reactive ion etch process including hydrogen radicals | Matt Hamrah, Ian J. Morey | 1993-09-07 |
| 5176790 | Process for forming a via in an integrated circuit structure by etching through an insulation layer while inhibiting sputtering of underlying metal | Paul Arleo, Jon Henri, Jerry Wong, Robert Wu | 1993-01-05 |
| 5057186 | Method of taper-etching with photoresist adhesion layer | Hongzong Chew, Catherine Ann Fieber, Edward P. Martin, Jr. | 1991-10-15 |
| 5026666 | Method of making integrated circuits having a planarized dielectric | Robert D. Huttemann, Kolawole R. Olasupo | 1991-06-25 |
| 4980301 | Method for reducing mobile ion contamination in semiconductor integrated circuits | Alain Harrus, Cris W. Lawrence, Morgan J. Thoma | 1990-12-25 |
| 4832789 | Semiconductor devices having multi-level metal interconnects | William T. Cochran, Agustin M. Garcia, Jenn L. Yeh | 1989-05-23 |