YS

Yuh-Jia Su

Applied Materials: 9 patents #1,414 of 7,310Top 20%
NS Novellus Systems: 6 patents #147 of 780Top 20%
AT Applied Komatsu Technology: 5 patents #11 of 62Top 20%
SS Stmicroelectronics Sa: 2 patents #1,857 of 4,662Top 40%
Overall (All Time): #225,218 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8058181 Method for post-etch cleans David Chen, Eddie Chiu, Maria Paola Pozzoli, Senzi Li, Giuseppe Colangelo +2 more 2011-11-15
7569492 Method for post-etch cleans David Chen, Eddie Chiu, Maria Paola Pozzoli, Senzi Li, Giuseppe Colangelo +2 more 2009-08-04
7390755 Methods for post etch cleans David Chen, Eddie Chiu, Maria Paola Pozzoli, Senzi Li, Giuseppe Colangelo +2 more 2008-06-24
7160813 Etch back process approach in dual source plasma reactors Cindy W. Chen, Eddie Chiu, Mavis J. Chaboya 2007-01-09
6955177 Methods for post polysilicon etch photoresist and polymer removal with minimal gate oxide loss Eddie Chiu, Cindy W. Chen, Wesley P. Graff 2005-10-18
6855225 Single-tube interlaced inductively coupling plasma source David Chen, Vincent Decaux 2005-02-15
6125788 Plasma reactor with enhanced plasma uniformity by gas addition, reduced chamber diameter and reduced RF wafer pedestal diameter Graham W. Hills 2000-10-03
5996218 Method of forming an electrostatic chuck suitable for magnetic flux processing Shamouil Shamouilian, John F. Cameron, Chandra Deshpandey 1999-12-07
5895937 Tapered dielectric etch in semiconductor devices Yuen-Kui Wong, Kam S. Law, Haruhiro (Harry) Goto 1999-04-20
5893757 Tapered profile etching method Yuen-Kui Wong, Kam S. Law 1999-04-13
5843277 Dry-etch of indium and tin oxides with C2H5I gas Haruhiro Harry Goto, Yuen-Kui Wong, Kam S. Law 1998-12-01
5744049 Plasma reactor with enhanced plasma uniformity by gas addition, and method of using same Graham W. Hills 1998-04-28
5728608 Tapered dielectric etch in semiconductor devices Yuen-Kui Wong, Kam S. Law, Haruhiro (Harry) Goto 1998-03-17
5685914 Focus ring for semiconductor wafer processing in a plasma reactor Graham W. Hills, Yoshiaki Tanase, Robert E. Ryan 1997-11-11
5607602 High-rate dry-etch of indium and tin oxides by hydrogen and halogen radicals such as derived from HCl gas Yuen-Kui Wong, Kam S. Law, Haruhiro Harry Goto 1997-03-04
5592358 Electrostatic chuck for magnetic flux processing Shamouil Shamouilian, John F. Cameron, Chandra Deshpandey 1997-01-07
5589002 Gas distribution plate for semiconductor wafer processing apparatus with means for inhibiting arcing 1996-12-31
5528451 Erosion resistant electrostatic chuck 1996-06-18
5507874 Method of cleaning of an electrostatic chuck in plasma reactors Richard Muh 1996-04-16
5410122 Use of electrostatic forces to reduce particle contamination in semiconductor plasma processing chambers Anand Gupta, Graham W. Hills, Joseph Lanucha 1995-04-25