CL

Cissy Leung

Applied Materials: 25 patents #481 of 7,310Top 7%
Overall (All Time): #165,831 of 4,157,543Top 4%
25
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6251190 Gate electrode connection structure by in situ chemical vapor deposition of tungsten and tungsten nitride Alfred Mak, Kevin Lai, Steve Ghanayem, Thomas Wendling, Ping Jian 2001-06-26
6206967 Low resistivity W using B2H6 nucleation step Alfred Mak, Kevin Lai, Dennis Sauvage 2001-03-27
6167834 Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 2001-01-02
6162715 Method of forming gate electrode connection structure by in situ chemical vapor deposition of tungsten and tungsten nitride Alfred Mak, Kevin Lai, Steve Ghanayem, Thomas Wendling, Ping Jian 2000-12-19
6099904 Low resistivity W using B.sub.2 H.sub.6 nucleation step Alfred Mak, Kevin Lai, Dennis Sauvage 2000-08-08
RE36623 Process for PECVD of silicon oxide using TEOS decomposition David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 2000-03-21
5871811 Method for protecting against deposition on a selected region of a substrate David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 1999-02-16
5810936 Plasma-inert cover and plasma cleaning process and apparatus employing same Lawrence Chung-Lai Lei, Sasson Somekh 1998-09-22
5755886 Apparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processing David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 1998-05-26
5705080 Plasma-inert cover and plasma cleaning process Lawrence Chung-Lai Lei, Sasson Somekh 1998-01-06
5556476 Controlling edge deposition on semiconductor substrates Lawrence Chung-Lai Lei 1996-09-17
5476548 Reducing backside deposition in a substrate processing apparatus through the use of a shadow ring Lawrence Chung-Lai Lei, Eric A. Englhardt, Ashok Sinha 1995-12-19
5468298 Bottom purge manifold for CVD tungsten process Lawrence Chung-Lai Lei 1995-11-21
5449410 Plasma processing apparatus Mei Chang 1995-09-12
5362526 Plasma-enhanced CVD process using TEOS for depositing silicon oxide David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 1994-11-08
5354715 Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 1994-10-11
5332443 Lift fingers for substrate processing apparatus Sandy M. Chew, Shane D. Clark, Ron Rose, Dale R. DuBois, Alan F. Morrison +1 more 1994-07-26
5213650 Apparatus for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer David N. Wang, Lawrence Chung-Lai Lei, Mei Chang 1993-05-25
5201990 Process for treating aluminum surfaces in a vacuum apparatus Mei Chang, Ashok Sinha, Turgut Sahin, Alfred Mak 1993-04-13
5075256 Process for removing deposits from backside and end edge of semiconductor wafer while preventing removal of materials from front surface of wafer David N. Wang, Lawrence Chung-Lai Lei, Mei Chang 1991-12-24
5028565 Process for CVD deposition of tungsten layer on semiconductor wafer Mei Chang, David N. Wang, David Cheng 1991-07-02
5000113 Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 1991-03-19
4960488 Reactor chamber self-cleaning process Kam S. Law, Ching Chiang Tang, Kenneth S. Collins, Mei Chang, Jerry Wong +1 more 1990-10-02
4892753 Process for PECVD of silicon oxide using TEOS decomposition David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 1990-01-09
4872947 CVD of silicon oxide using TEOS decomposition and in-situ planarization process David N. Wang, John M. White, Kam S. Law, Salvador P. Umotoy, Kenneth S. Collins +3 more 1989-10-10