Issued Patents All Time
Showing 51–75 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6074512 | Inductively coupled RF plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners | Kenneth S. Collins, Michael R. Rice, Douglas A. Buchberger, Jr., Craig A. Roderick, Eric Askarinam +5 more | 2000-06-13 |
| 6071372 | RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls | Yan Ye, Donald Olgado, Avi Tepman, Diana Xiaobing Ma, Peter Loewenhardt +2 more | 2000-06-06 |
| 6036877 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, David W. Groechel, Jon Mohn, Craig A. Roderick +5 more | 2000-03-14 |
| 6030486 | Magnetically confined plasma reactor for processing a semiconductor wafer | Peter Loewenhardt, Philip M. Salzman | 2000-02-29 |
| 6024826 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, David W. Groechel, Jon Mohn, Craig A. Roderick +5 more | 2000-02-15 |
| 6020686 | Inductively and multi-capacitively coupled plasma reactor | Yan Ye, Hiroji Hanawa, Diana Xiaobing Ma | 2000-02-01 |
| 6010603 | Patterned copper etch for micron and submicron features, using enhanced physical bombardment | Yan Ye, Diana Xiaobing Ma | 2000-01-04 |
| 5990017 | Plasma reactor with heated source of a polymer-hardening precursor material | Kenneth S. Collins, Michael R. Rice, David W. Groechel, Jon Mohn, Craig A. Roderick +5 more | 1999-11-23 |
| 5965035 | Self aligned contact etch using difluoromethane and trifluoromethane | Raymond Hung, Jian Ding, Joseph P. Caulfield | 1999-10-12 |
| 5965463 | Silane etching process | Chunshi Cui, Robert Wu | 1999-10-12 |
| 5904778 | Silicon carbide composite article particularly useful for plasma reactors | Hao Lu, Nianci Han, Robert Wu | 1999-05-18 |
| 5900062 | Lift pin for dechucking substrates | Peter Loewenhardt, Hiroji Hanawa, Raymond Gristi, Yan Ye | 1999-05-04 |
| 5897712 | Plasma uniformity control for an inductive plasma source | Hiroji Hanawa, Peter Loewenhardt, Timothy D. Driscoll | 1999-04-27 |
| 5891348 | Process gas focusing apparatus and method | Yan Ye, Diana Xiaobing Ma, Steve S. Y. Mak | 1999-04-06 |
| 5885358 | Gas injection slit nozzle for a plasma process reactor | Dan Maydan, Steve S. Y. Mak, Donald Olgado, Timothy D. Driscoll, James S. Papanu +1 more | 1999-03-23 |
| 5883017 | Compartmentalized substrate processing chamber | Avi Tepman, Donald Olgado | 1999-03-16 |
| 5817534 | RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers | Yan Ye, Hiroji Hanawa, Diana Xiaobing Ma, Peter Loewenhardt, Donald Olgado +2 more | 1998-10-06 |
| 5783101 | High etch rate residue free metal etch process with low frequency high power inductive coupled plasma | Diana Xiaobing Ma, Hiroji Hanawa | 1998-07-21 |
| 5777289 | RF plasma reactor with hybrid conductor and multi-radius dome ceiling | Hiroji Hanawa, Diana Xiaobing Ma, Philip M. Salzman, Peter Loewenhardt, Allen Zhao | 1998-07-07 |
| 5756400 | Method and apparatus for cleaning by-products from plasma chamber surfaces | Yan Ye, Diana Xiaobing Ma, Keshav Prasad, Mark Siegel, Steve S. Y. Mak +3 more | 1998-05-26 |
| 5753137 | Dry cleaning of semiconductor processing chambers using non-metallic, carbon-comprising material | Yan Ye, Charles S. Rhoades | 1998-05-19 |
| 5753044 | RF plasma reactor with hybrid conductor and multi-radius dome ceiling | Hiroji Hanawa, Diana Xiabing Ma, Phil Salzman, Peter Loewenhardt, Allen Zhao | 1998-05-19 |
| 5746875 | Gas injection slit nozzle for a plasma process reactor | Dan Maydan, Steve S. Y. Mak, Donald Olgado, Timothy D. Driscoll, James S. Papanu +1 more | 1998-05-05 |
| 5730801 | Compartnetalized substrate processing chamber | Avi Tepman, Donald Olgado | 1998-03-24 |
| 5710486 | Inductively and multi-capacitively coupled plasma reactor | Yan Ye, Hiroji Hanawa, Diana Xiaobing Ma | 1998-01-20 |