GY

Gerald Yin

Applied Materials: 74 patents #80 of 7,310Top 2%
AE Advanced Micro-Fabrication Equipment: 8 patents #2 of 61Top 4%
AC Advanced Micro-Fabrication Equipment Inc. China: 2 patents #15 of 57Top 30%
Lam Research: 2 patents #1,015 of 2,128Top 50%
IN Intel: 1 patents #18,218 of 30,777Top 60%
📍 Shanghai, CA: #48 of 801 inventorsTop 6%
Overall (All Time): #18,370 of 4,157,543Top 1%
89
Patents All Time

Issued Patents All Time

Showing 76–89 of 89 patents

Patent #TitleCo-InventorsDate
5685916 Dry cleaning of semiconductor processing chambers Yan Ye, Charles S. Rhoades 1997-11-11
5676759 Plasma dry cleaning of semiconductor processing chambers Yan Ye, Charles S. Rhoades 1997-10-14
5643394 Gas injection slit nozzle for a plasma process reactor Dan Maydan, Steve S. Y. Mak, Donald Olgado, Timothy D. Driscoll, Brian Sy-Yuan Shieh +1 more 1997-07-01
5607542 Inductively enhanced reactive ion etching Robert Wu 1997-03-04
5573596 Arc suppression in a plasma processing system 1996-11-12
5565681 Ion energy analyzer with an electrically controlled geometric filter Peter Loewenhardt 1996-10-15
5556501 Silicon scavenger in an inductively coupled RF plasma reactor Kenneth S. Collins, Craig A. Roderick, John Trow, Chan-Lon Yang, Jerry Wong +7 more 1996-09-17
5540824 Plasma reactor with multi-section RF coil and isolated conducting lid Hiroji Hanawa, Diana Xiabing Ma, Donald Olgado 1996-07-30
5534108 Method and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactor Xue-Yu Qian, Graham W. Hills, Robert Steger 1996-07-09
5486235 Plasma dry cleaning of semiconductor processing chambers Yan Ye, Charles S. Rhoades 1996-01-23
5451784 Composite diagnostic wafer for semiconductor wafer processing systems Peter Loewenhardt, Hiroji Hanawa 1995-09-19
5198725 Method of producing flat ECR layer in microwave plasma device and apparatus therefor Ching-Hwa Chen, Takashi Inoue 1993-03-30
4871421 Split-phase driver for plasma etch system John S. Ogle 1989-10-03
4808259 Plasma etching process for MOS circuit pregate etching utiliizing a multi-step power reduction recipe Don W. Jillie, Jr., Glen Wada 1989-02-28