| 5753137 |
Dry cleaning of semiconductor processing chambers using non-metallic, carbon-comprising material |
Yan Ye, Gerald Yin |
1998-05-19 |
| 5685916 |
Dry cleaning of semiconductor processing chambers |
Yan Ye, Gerald Yin |
1997-11-11 |
| 5676759 |
Plasma dry cleaning of semiconductor processing chambers |
Yan Ye, Gerald Yin |
1997-10-14 |
| 5545289 |
Passivating, stripping and corrosion inhibition of semiconductor substrates |
Jian-Sheng Chen, James S. Papanu, Steve S. Y. Mak, Carmel Ish-Shalom, Peter Hsieh +5 more |
1996-08-13 |
| 5494523 |
Controlling plasma particulates by contouring the plasma sheath using materials of differing RF impedances |
Robert Steger, Anand Gupta |
1996-02-27 |
| 5486235 |
Plasma dry cleaning of semiconductor processing chambers |
Yan Ye, Gerald Yin |
1996-01-23 |
| 5423918 |
Method for reducing particulate contamination during plasma processing of semiconductor devices |
Anand Gupta, Yan Ye, Joseph Lanucha |
1995-06-13 |
| 5387556 |
Etching aluminum and its alloys using HC1, C1-containing etchant and N.sub. 2 |
Diana M. Xiaobing |
1995-02-07 |
| 5384009 |
Plasma etching using xenon |
Steven Mak, Brian Sy-Yuan Shieh |
1995-01-24 |
| 5221424 |
Method for removal of photoresist over metal which also removes or inactivates corosion-forming materials remaining from previous metal etch |
— |
1993-06-22 |
