DM

Denis Morrissey

SL Shipley Company, L.L.C.: 8 patents #35 of 401Top 9%
KT Kollmorgen Technologies: 1 patents #57 of 123Top 50%
OC Omg Electronic Chemicals: 1 patents #3 of 11Top 30%
📍 Glen Cove, NY: #17 of 158 inventorsTop 15%
🗺 New York: #14,659 of 115,490 inventorsTop 15%
Overall (All Time): #514,891 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
9202946 Methods for metallizing an aluminum paste Richard A. Bellemare, Anthony M. Piano 2015-12-01
6797146 Seed layer repair Jeffrey M. Calvert, Robert D. Mikkola 2004-09-28
6679983 Method of electrodepositing copper Robert D. Mikkola, Jeffrey M. Calvert 2004-01-20
6660154 Seed layer David Merricks, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann 2003-12-09
6660153 Seed layer repair bath David Merricks, Martin W. Bayes, Mark Lefebvre, James G. Shelnut, Donald E. Storjohann 2003-12-09
6649038 Electroplating method Robert D. Mikkola, Jeffrey M. Calvert 2003-11-18
6610192 Copper electroplating Eugene N. Step, Robert A. Binstead 2003-08-26
6531046 Seed layer repair method David Merricks, Leon Barstad, Eugene N. Step, Jeffrey M. Calvert, Robert Schetty +4 more 2003-03-11
6508924 Control of breakdown products in electroplating baths Luis A. Gomez, Rozalia Beica, Eugene N. Step 2003-01-21
4683036 Method for electroplating non-metallic surfaces Peter E. Takach, Rudolph J. Zeblisky 1987-07-28