Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Endpoint detection for chemical mechanical polishing based on spectrometry

Endpoint detection for chemical mechanical polishing based on spectrometry

US Patent 11715672 · Granted Aug 1, 2023

Estimated economic value: $66,604,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Passive acoustic monitoring and acoustic sensors for chemical mechanical polishi2025
Passive acoustic monitoring and acoustic sensors for chemical mechanical polishi2025
Polishing apparatus using neural network for monitoring2025
Resistivity-based adjustment of thresholds for in-situ monitoring2025
Pixel classification of film non-uniformity based on processing of substrate ima2025
Region classification of film non-uniformity based on processing of substrate im2025
Residue measurement from machine learning based processing of substrate images2025
Machine vision as input to a CMP process control algorithm2025
Machine vision as input to a CMP process control algorithm2025
Polishing system with capacitive shear sensor2025
Wafer bin map based root cause analysis2025
System using film thickness estimation from machine learning based processing of2024