Issued Patents All Time
Showing 101–125 of 176 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8284560 | Eddy current sensor with enhanced edge resolution | Hassan G. Iravani, Ingemar Carlsson | 2012-10-09 |
| 8260446 | Spectrographic monitoring of a substrate during processing using index values | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah | 2012-09-04 |
| 8187977 | Automatic gain control | Doyle E. Bennett | 2012-05-29 |
| 8125654 | Methods and apparatus for measuring substrate edge thickness during polishing | Dominic J. Benvegnu, Sen-Hou Ko, Abraham Ravid, Paul V. Miller | 2012-02-28 |
| 8088298 | Spectra based endpointing for chemical mechanical polishing | Dominic J. Benvegnu, Jeffrey Drue David | 2012-01-03 |
| 8039397 | Using optical metrology for within wafer feed forward process control | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu, Zhize Zhu, Wen-Chiang Tu | 2011-10-18 |
| 8014004 | Determining physical property of substrate | Abraham Ravid, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu +2 more | 2011-09-06 |
| 7999540 | Eddy current apparatus and method for in-situ profile measurement | G. Laurie Miller, Manoocher Birang | 2011-08-16 |
| 7952708 | High throughput measurement system | Abraham Ravid, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian, Sidney P. Huey +3 more | 2011-05-31 |
| 7942724 | Polishing pad with window having multiple portions | Dominic J. Benvegnu, Jimin Zhang | 2011-05-17 |
| 7927182 | Polishing system with in-line and in-situ metrology | Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang | 2011-04-19 |
| 7840375 | Methods and apparatus for generating a library of spectra | Abraham Ravid, Dominic J. Benvegnu, Jeffrey Drue David, Jun Qian, Sidney P. Huey +3 more | 2010-11-23 |
| 7774086 | Substrate thickness measuring during polishing | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah | 2010-08-10 |
| 7768659 | Determining copper concentration in spectra | Dominic J. Benvegnu, Jeffrey Drue David, Jimin Zhang, Harry Q. Lee | 2010-08-03 |
| 7746485 | Determining physical property of substrate | Abraham Ravid, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu +2 more | 2010-06-29 |
| 7682221 | Integrated endpoint detection system with optical and eddy current monitoring | Manoocher Birang, Nils Johansson | 2010-03-23 |
| 7621798 | Reducing polishing pad deformation | Doyle E. Bennett, David J. Lischka | 2009-11-24 |
| 7591708 | Method and apparatus of eddy current monitoring for chemical mechanical polishing | Manoocher Birang, Hyeong Cheol Kim | 2009-09-22 |
| 7585202 | Computer-implemented method for process control in chemical mechanical polishing | Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang | 2009-09-08 |
| 7513818 | Polishing endpoint detection system and method using friction sensor | Gabriel L. Miller, Manoocher Birang, Nils Johansson, Dominic J. Benvegnu | 2009-04-07 |
| 7500901 | Data processing for monitoring chemical mechanical polishing | Nils Johansson, Manoocher Birang | 2009-03-10 |
| 7494929 | Automatic gain control | Doyle E. Bennett | 2009-02-24 |
| 7444198 | Determining physical property of substrate | Abraham Ravid, Jeffrey Drue David, Jun Qian, Ingemar Carlsson, Dominic J. Benvegnu +2 more | 2008-10-28 |
| 7429207 | System for endpoint detection with polishing pad | Manoocher Birang | 2008-09-30 |
| 7409260 | Substrate thickness measuring during polishing | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah | 2008-08-05 |