Issued Patents All Time
Showing 76–100 of 176 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8657646 | Endpoint detection using spectrum feature trajectories | Dominic J. Benvegnu | 2014-02-25 |
| 8628376 | In-line wafer thickness sensing | Garrett H. Sin, Sanjeev Kumar Jain, Lakshmanan Karuppiah | 2014-01-14 |
| 8616935 | Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing | Jimin Zhang, Ingemar Carlsson, Stephen Jew | 2013-12-31 |
| 8591698 | Peak-based endpointing for chemical mechanical polishing | Dominic J. Benvegnu, David J. Lischka | 2013-11-26 |
| 8585790 | Treatment of polishing pad window | Dominic J. Benvegnu | 2013-11-19 |
| 8579675 | Methods of using optical metrology for feed back and feed forward process control | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu, Zhize Zhu, Wen-Chiang Tu | 2013-11-12 |
| 8569174 | Using spectra to determine polishing endpoints | Harry Q. Lee, Dominic J. Benvegnu, Jeffrey Drue David | 2013-10-29 |
| 8563335 | Method of controlling polishing using in-situ optical monitoring and fourier transform | Dominic J. Benvegnu | 2013-10-22 |
| 8562389 | Thin polishing pad with window and molding process | Dominic J. Benvegnu, Jimin Zhang, Thomas H. Osterheld | 2013-10-22 |
| 8554351 | Spectrographic monitoring of a substrate during processing using index values | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Lakshmanan Karuppiah | 2013-10-08 |
| 8535115 | Gathering spectra from multiple optical heads | Jeffrey Drue David, Dominic J. Benvegnu, Sivakumar Dhandapani | 2013-09-17 |
| 8518827 | Spectrum based endpointing for chemical mechanical polishing | Dominic J. Benvegnu, Jeffrey Drue David | 2013-08-27 |
| 8485862 | Polishing pad for endpoint detection and related methods | Manoocher Birang | 2013-07-16 |
| 8475228 | Polishing pad with partially recessed window | Dominic J. Benvegnu, Jimin Zhang | 2013-07-02 |
| 8460057 | Computer-implemented process control in chemical mechanical polishing | Bret W. Adams, Sanjay Rajaram, David A. Chan, Manoocher Birang | 2013-06-11 |
| 8393940 | Molding windows in thin pads | Doyle E. Bennett, Dominic J. Benvegnu | 2013-03-12 |
| 8393933 | Polishing pad and system with window support | Jun Qian, Dominic J. Benvegnu, Ningzhuo Cui, Thomas H. Osterheld | 2013-03-12 |
| 8392012 | Multiple libraries for spectrographic monitoring of zones of a substrate during processing | Jeffrey Drue David, Harry Q. Lee | 2013-03-05 |
| 8369978 | Adjusting polishing rates by using spectrographic monitoring of a substrate during processing | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee | 2013-02-05 |
| 8352061 | Semi-quantitative thickness determination | Dominic J. Benvegnu, Jeffrey Drue David, Harry Q. Lee | 2013-01-08 |
| 8342906 | Friction sensor for polishing system | Gabriel L. Miller, Manoocher Birang, Nils Johansson, Dominic J. Benvegnu | 2013-01-01 |
| 8337278 | Wafer edge characterization by successive radius measurements | Ignasi Palou-Rivera, Lakshmanan Karuppiah | 2012-12-25 |
| 8292693 | Using optical metrology for wafer to wafer feed back process control | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu, Zhize Zhu, Wen-Chiang Tu | 2012-10-23 |
| 8295967 | Endpoint control of multiple-wafer chemical mechanical polishing | Jimin Zhang, Thomas H. Osterheld, Ingemar Carlsson, Stephen Jew | 2012-10-23 |
| 8287330 | Reducing polishing pad deformation | Doyle E. Bennett, David J. Lischka | 2012-10-16 |