Issued Patents All Time
Showing 26–50 of 176 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10391610 | Core configuration for in-situ electromagnetic induction monitoring system | Hassan G. Iravani, Kun Xu, Denis Ivanov, Shih-Haur Shen | 2019-08-27 |
| 10276460 | Endpointing detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Jeffrey Drue David | 2019-04-30 |
| 10207386 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2019-02-19 |
| 10199281 | Substrate features for inductive monitoring of conductive trench depth | Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani +2 more | 2019-02-05 |
| 10105811 | Eddy current system having an elongated core for in-situ profile measurement | G. Laurie Miller, Manoocher Birang | 2018-10-23 |
| 10103073 | Inductive monitoring of conductive trench depth | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more | 2018-10-16 |
| 10086492 | Applying dimensional reduction to spectral data from polishing substrates | Jeffrey Drue David, Benjamin Cherian | 2018-10-02 |
| 10012494 | Grouping spectral data from polishing substrates | Jeffrey Drue David | 2018-07-03 |
| 9911664 | Substrate features for inductive monitoring of conductive trench depth | Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani +2 more | 2018-03-06 |
| 9886026 | Endpoint method using peak location of spectra contour plots versus time | Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu | 2018-02-06 |
| 9833874 | Applying dimensional reduction to spectral data from polishing substrates | Jeffrey Drue David, Benjamin Cherian | 2017-12-05 |
| 9799578 | Peak-based endpointing for chemical mechanical polishing | Dominic J. Benvegnu, David J. Lischka | 2017-10-24 |
| 9754846 | Inductive monitoring of conductive trench depth | Wei Lu, Zhefu Wang, Zhihong Wang, Hassan G. Iravani, Dominic J. Benvegnu +2 more | 2017-09-05 |
| 9636797 | Adjusting eddy current measurements | Kun Xu, Ingemar Carlsson, Doyle E. Bennett, Shih-Haur Shen, Hassan G. Iravani +2 more | 2017-05-02 |
| 9583405 | Endpointing detection for chemical mechanical polishing based on spectrometry | Dominic J. Benvegnu, Jeffrey Drue David | 2017-02-28 |
| 9564377 | Peak-based endpointing for chemical mechanical polishing | Dominic J. Benvegnu, David J. Lischka | 2017-02-07 |
| 9551567 | Reducing noise in spectral data from polishing substrates | Jeffrey Drue David, Benjamin Cherian | 2017-01-24 |
| 9496190 | Feedback of layer thickness timing and clearance timing for polishing control | Kun Xu, Feng Q. Liu, Dominic J. Benvegnu, Yuchun Wang, Wen-Chiang Tu +1 more | 2016-11-15 |
| 9482610 | Techniques for matching spectra | Kiran Shrestha, Jeffrey Drue David, Harry Q. Lee | 2016-11-01 |
| 9472475 | Feedback control using detection of clearance and adjustment for uniform topography | Kun Xu, Ingemar Carlsson, Tzu-Yu Liu, Shih-Haur Shen, Wen-Chiang Tu +1 more | 2016-10-18 |
| 9346146 | Adjusting polishing rates by using spectrographic monitoring of a substrate during processing | Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee | 2016-05-24 |
| 9333621 | Polishing pad for endpoint detection and related methods | Manoocher Birang | 2016-05-10 |
| 9281253 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2016-03-08 |
| 9275917 | Determination of gain for eddy current sensor | Kun Xu, Shih-Haur Shen, Ingemar Carlsson, Doyle E. Bennett, Wen-Chiang Tu +2 more | 2016-03-01 |
| 9227293 | Multi-platen multi-head polishing architecture | Jeffrey Drue David, Doyle E. Bennett, Thomas H. Osterheld, Benjamin Cherian, Dominic J. Benvegnu +3 more | 2016-01-05 |