Issued Patents All Time
Showing 1–25 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315569 | Transcription and analysis of meeting recordings | Rémi Berson, Eric Pellish | 2022-04-26 |
| 7704880 | Method of forming contact layers on substrates | Cyprian Emeka Uzoh, Bulent M. Basol, Hung-Ming Wang | 2010-04-27 |
| 7648622 | System and method for electrochemical mechanical polishing | Bulent M. Basol | 2010-01-19 |
| 7578923 | Electropolishing system and process | Bulent M. Basol | 2009-08-25 |
| 7572354 | Electrochemical processing of conductive surface | Cyprian Emeka Uzoh, Bulent M. Basol, Douglas W. Young | 2009-08-11 |
| 7491308 | Method of making rolling electrical contact to wafer front surface | Cyprian Emeka Uzoh, Bulent M. Basol | 2009-02-17 |
| 7476304 | Apparatus for processing surface of workpiece with small electrodes and surface contacts | Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Cyprian Emeka Uzoh | 2009-01-13 |
| 7427337 | System for electropolishing and electrochemical mechanical polishing | Bulent M. Basol, Jalal Ashjaee, Boris Govzman, Bernard Frey | 2008-09-23 |
| 7425250 | Electrochemical mechanical processing apparatus | Bulent M. Basol | 2008-09-16 |
| 7416975 | Method of forming contact layers on substrates | Cyprian Emeka Uzoh, Bulent M. Basol, Hung-Ming Wang | 2008-08-26 |
| 7378004 | Pad designs and structures for a versatile materials processing apparatus | Cyprian Emeka Uzoh, Bulent M. Basol | 2008-05-27 |
| 7341649 | Apparatus for electroprocessing a workpiece surface | — | 2008-03-11 |
| 7329335 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Cyprian Emeka Uzoh, Bulent M. Basol | 2008-02-12 |
| 7311811 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Cyprian Emeka Uzoh, Bulent M. Basol | 2007-12-25 |
| 7309406 | Method and apparatus for plating and polishing semiconductor substrate | Cyprian Emeka Uzoh | 2007-12-18 |
| 7309407 | Method and apparatus for forming an electrical contact with a semiconductor substrate | Bulent M. Basol | 2007-12-18 |
| 7309413 | Providing electrical contact to the surface of a semiconductor workpiece during processing | Cyprian Emeka Uzoh, Bulent M. Basol | 2007-12-18 |
| 7282124 | Device providing electrical contact to the surface of a semiconductor workpiece during processing | Cyprian Emeka Uzoh, Bulent M. Basol | 2007-10-16 |
| 7257893 | Efficient wafer processing technology | Hung-Ming Wang, Bulent M. Basol | 2007-08-21 |
| 7250104 | Method and system for optically enhanced metal planarization | Cyprian Emeka Uzoh, Bulent M. Basol, Halit Yakupoglu | 2007-07-31 |
| 7247558 | Method and system for electroprocessing conductive layers | Bulent M. Basol | 2007-07-24 |
| 7244347 | Method and system to provide electrical contacts for electrotreating processes | Bulent M. Basol, Cyprian Emeka Uzoh | 2007-07-17 |
| 7211186 | Method and system to provide electrical contacts for electrotreating processes | Bulent M. Basol | 2007-05-01 |
| 7211174 | Method and system to provide electrical contacts for electrotreating processes | Bulent M. Basol, Boguslaw Nagorski, Cyprian Emeka Uzoh, Jeffrey Bogart | 2007-05-01 |
| 7204924 | Method and apparatus to deposit layers with uniform properties | Bulent M. Basol | 2007-04-17 |