Issued Patents All Time
Showing 26–50 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7204924 | Method and apparatus to deposit layers with uniform properties | Bulent M. Basol | 2007-04-17 |
| 7198551 | Substrate polishing apparatus | — | 2007-04-03 |
| 7172497 | Fabrication of semiconductor interconnect structures | Bulent M. Basol | 2007-02-06 |
| 7147766 | Chip interconnect and packaging deposition methods and structures | Cyprian Emeka Uzoh, Bulent M. Basol | 2006-12-12 |
| 7129165 | Method and structure to improve reliability of copper interconnects | Bulent M. Basol | 2006-10-31 |
| 7122473 | Edge and bevel cleaning process and system | Jalal Ashjaee, Rimma Volodarsky, Cyprian Emeka Uzoh, Bulent M. Basol | 2006-10-17 |
| 7115510 | Method for electrochemically processing a workpiece | Bulent M. Basol, Cyprian Emeka Uzoh | 2006-10-03 |
| 7097538 | Advanced chemical mechanical polishing system with smart endpoint detection | Bulent M. Basol | 2006-08-29 |
| 7097755 | Electrochemical mechanical processing with advancible sweeper | Bulent M. Basol, Halit Yakupoglu, Cyprian Emeka Uzoh | 2006-08-29 |
| 7059944 | Integrated system for processing semiconductor wafers | Jalal Ashjaee, Boris Govzman, Bernard Frey, Boguslaw Nagorski, Douglas W. Young +1 more | 2006-06-13 |
| 6988932 | Apparatus of sealing wafer backside for full-face processing | Jalal Ashjaee, Bulent M. Basol, Konstantin Volodarsky | 2006-01-24 |
| 6974769 | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-12-13 |
| 6969456 | Method of using vertically configured chamber used for multiple processes | Konstantin Volodarsky, Boguslaw Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Emeka Uzoh | 2005-11-29 |
| 6958114 | Method and apparatus for forming an electrical contact with a semiconductor substrate | Bulent M. Basol | 2005-10-25 |
| 6953392 | Integrated system for processing semiconductor wafers | Jalal Ashjaee | 2005-10-11 |
| 6951507 | Substrate polishing apparatus | — | 2005-10-04 |
| 6946066 | Multi step electrodeposition process for reducing defects and minimizing film thickness | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-09-20 |
| 6942780 | Method and apparatus for processing a substrate with minimal edge exclusion | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-09-13 |
| 6939203 | Fluid bearing slide assembly for workpiece polishing | Douglas W. Young | 2005-09-06 |
| 6939206 | Method and apparatus of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Bulent M. Basol, Konstantin Volodarsky | 2005-09-06 |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-08-23 |
| 6932679 | Apparatus and method for loading a wafer in polishing system | Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young | 2005-08-23 |
| 6908374 | Chemical mechanical polishing endpoint detection | Yuchun Wang, Bernard Frey, Bulent M. Basol, Douglas W. Young, Efrain Velazquez | 2005-06-21 |
| 6905588 | Packaging deposition methods | Cyprian Emeka Uzoh, Bulent M. Basol | 2005-06-14 |
| 6902659 | Method and apparatus for electro-chemical mechanical deposition | — | 2005-06-07 |