Issued Patents All Time
Showing 51–75 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6884334 | Vertically configured chamber used for multiple processes | Konstantin Volodarsky, Boguslaw A. Nigorski, Rimma Volodarsky, Douglas W. Young, Cyprian Emeka Uzoh | 2005-04-26 |
| 6867136 | Method for electrochemically processing a workpiece | Bulent M. Basol, Cyprian Emeka Uzoh | 2005-03-15 |
| 6861354 | Method and structure to reduce defects in integrated circuits and substrates | Cyprian Emeka Uzoh, Bulent M. Basol | 2005-03-01 |
| 6857947 | Advanced chemical mechanical polishing system with smart endpoint detection | Yuchun Wang, Bernard Frey, Bulent M. Basol, Douglas W. Young, Brett E. McGrath +3 more | 2005-02-22 |
| 6855037 | Method of sealing wafer backside for full-face electrochemical plating | Jalal Ashjaee, Bulent M. Basol, Konstantin Volodarsky | 2005-02-15 |
| 6852630 | Electroetching process and system | Bulent M. Basol, Cyprian Emeka Uzoh, Halit Yakupoglu | 2005-02-08 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer | Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Cyprian Emeka Uzoh | 2005-02-08 |
| 6837979 | Method and apparatus for depositing and controlling the texture of a thin film | Cyprian Emeka Uzoh | 2005-01-04 |
| 6821409 | Electroetching methods and systems using chemical and mechanical influence | Bulent M. Basol, Cyprian Emeka Uzoh, Paul Lindquist | 2004-11-23 |
| 6815354 | Method and structure for thru-mask contact electrodeposition | Cyprian Emeka Uzoh, Bulent M. Basol | 2004-11-09 |
| 6797132 | Apparatus for plating and polishing a semiconductor workpiece | Cyprian Emeka Uzoh | 2004-09-28 |
| 6780772 | Method and system to provide electroplanarization of a workpiece with a conducting material layer | Cyprian Emeka Uzoh, Bulent M. Basol | 2004-08-24 |
| 6777338 | Edge and bevel cleaning process and system | Jalal Ashjaee, Rimma Volodarsky, Cyprian Emeka Uzoh, Bulent M. Basol | 2004-08-17 |
| 6773576 | Anode assembly for plating and planarizing a conductive layer | Rimma Volodarsky, Konstantin Volodarsky, Cyprian Emeka Uzoh, Douglas W. Young | 2004-08-10 |
| 6722946 | Advanced chemical mechanical polishing system with smart endpoint detection | Bulent M. Basol | 2004-04-20 |
| 6695962 | Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs | Cyprian Emeka Uzoh, Bulent M. Basol | 2004-02-24 |
| 6692588 | Method and apparatus for simultaneously cleaning and annealing a workpiece | Cyprian Emeka Uzoh | 2004-02-17 |
| 6676822 | Method for electro chemical mechanical deposition | — | 2004-01-13 |
| 6666959 | Semiconductor workpiece proximity plating methods and apparatus | Cyprian Emeka Uzoh, Bulent M. Basol, Douglas W. Young | 2003-12-23 |
| 6649523 | Method and system to provide material removal and planarization employing a reactive pad | Bulent M. Basol, Cyprian Emeka Uzoh | 2003-11-18 |
| 6630059 | Workpeice proximity plating apparatus | Cyprian Emeka Uzoh, Bulent M. Basol, Douglas W. Young | 2003-10-07 |
| 6610190 | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate | Bulent M. Basol, Cyprian Emeka Uzoh | 2003-08-26 |
| 6604988 | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein | Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young | 2003-08-12 |
| 6497800 | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating | Cyprian Emeka Uzoh, Bulent M. Basol | 2002-12-24 |
| 6482307 | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing | Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Cyprian Emeka Uzoh | 2002-11-19 |