Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12024785 | Dual wafer plating fixture for a continuous plating line | Paul Loscutoff, Raphael M. Manalo, Arnold Villamor Castillo, Mohamad Ridzwan Mustafa, Mark Kleshock +1 more | 2024-07-02 |
| 12015884 | Method of layer blending and reconstruction based on the alpha channel | Yuan-Po Cheng | 2024-06-18 |
| 11824130 | Solar cell having a plurality of sub-cells coupled by cell level interconnection | Seung Bum Rim, David Okawa, Lewis Abra | 2023-11-21 |
| 11670262 | Method of generating OSD data | Yuan-Po Cheng | 2023-06-06 |
| 11598018 | Dual wafer plating fixture for a continuous plating line | Paul Loscutoff, Raphael M. Manalo, Arnold Villamor Castillo, Mohamad Ridzwan Mustafa, Mark Kleshock +1 more | 2023-03-07 |
| 11502213 | Solar cell having a plurality of sub-cells coupled by cell level interconnection | Seung Bum Rim, David Okawa, Lewis Abra | 2022-11-15 |
| 11195966 | Bifacial solar cells with reflective back contacts | David D. Smith, Sung Dug Kim, Joseph Behnke | 2021-12-07 |
| 11127871 | Structures and methods for forming electrodes of solar cells | Paul Loscutoff, Matthew Dawson, Mark Kleshock | 2021-09-21 |
| 10462449 | Method and system for 360-degree video playback | Min Sun, Hou-Ning Hu, Yen-Chen Lin, Hsien-Tzu Cheng, Chieh-Cheng Chen | 2019-10-29 |
| 10456791 | Method and apparatus for performing contactless optically-induced dielectrophoresis for separation of circulating tumor cells | Min Wu, Chia-Hsun Hsieh, Wen-Pin Chou, Tzu-Keng Chiu | 2019-10-29 |
| 9832446 | Method, device and system for packing color frame and original depth frame | Jar-Ferr Yang, Hsi-Chun Tseng, Ke Liao | 2017-11-28 |
| 9774844 | Unpacking method, unpacking device and unpacking system of packed frame | Jar-Ferr Yang, Hsi-Chun Tseng, Ke Liao | 2017-09-26 |
| 9680273 | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it | David N. Light, David Rodney Baker, Peter Nguyen, Dexter Shih-Wei Pao | 2017-06-13 |
| 9529825 | Method, device and system for restoring resized depth frame into original depth frame | Jar-Ferr Yang, Hsi-Chun Tseng | 2016-12-27 |
| 9521428 | Method, device and system for resizing original depth frame into resized depth frame | Jar-Ferr Yang, Hsi-Chun Tseng | 2016-12-13 |
| 7704880 | Method of forming contact layers on substrates | Cyprian Emeka Uzoh, Bulent M. Basol, Homayoun Talieh | 2010-04-27 |
| 7416975 | Method of forming contact layers on substrates | Cyprian Emeka Uzoh, Bulent M. Basol, Homayoun Talieh | 2008-08-26 |
| 7257893 | Efficient wafer processing technology | Bulent M. Basol, Homayoun Talieh | 2007-08-21 |
| 7098074 | Microelectronic assemblies having low profile connections | Michael Warner, Masud Beroz, David Light, Delin Li, Dennis Castillo +1 more | 2006-08-29 |
| 6685820 | Method for treating spent tin/lead stripping solution | Kuo-Chin Chen, Ching-Hwa Chang, Yu-Feng Lin, Tai-Sheng Yuan, Jenn-Fang Wu +1 more | 2004-02-03 |
| 6573459 | Graded metallic leads for connection to microelectronic elements | David Rodney Baker | 2003-06-03 |
| 6465744 | Graded metallic leads for connection to microelectronic elements | David Rodney Baker | 2002-10-15 |
| 6255723 | Layered lead structures | David Light, John W. Smith, Thomas H. DiStefano, David Rodney Baker | 2001-07-03 |
| 6248656 | Metal-jacketed lead manufacturing process using resist layers | David Rodney Baker, John Grange, David Light | 2001-06-19 |