| 7696439 |
Layered metal structure for interconnect element |
— |
2010-04-13 |
| 7309447 |
Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold |
Masud Beroz |
2007-12-18 |
| 7205659 |
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
Masud Beroz |
2007-04-17 |
| 7152311 |
Enhancements in framed sheet processing |
Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, John W. Smith |
2006-12-26 |
| 7098074 |
Microelectronic assemblies having low profile connections |
Michael Warner, Masud Beroz, Delin Li, Dennis Castillo, Hung-Ming Wang +1 more |
2006-08-29 |
| 7067742 |
Connection component with peelable leads |
Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis +1 more |
2006-06-27 |
| 6825552 |
Connection components with anisotropic conductive material interconnection |
Paula Lagattuta Tostado, Michael Warner |
2004-11-30 |
| 6808958 |
Methods of bonding microelectronic elements |
— |
2004-10-26 |
| 6794202 |
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
Masud Beroz |
2004-09-21 |
| 6657286 |
Microelectronic assembly formation with lead displacement |
— |
2003-12-02 |
| 6518160 |
Method of manufacturing connection components using a plasma patterned mask |
Joseph Fjelstad, Belgacem Haba |
2003-02-11 |
| 6357112 |
Method of making connection component |
Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis +1 more |
2002-03-19 |
| 6338982 |
Enhancements in framed sheet processing |
Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, John W. Smith |
2002-01-15 |
| 6333207 |
Peelable lead structure and method of manufacture |
John W. Smith |
2001-12-25 |
| 6274822 |
Manufacture of semiconductor connection components with frangible lead sections |
Belgacem Haba, Thomas H. DiStefano, Konstantine Karavakis |
2001-08-14 |
| 6255723 |
Layered lead structures |
John W. Smith, Thomas H. DiStefano, David Rodney Baker, Hung-Ming Wang |
2001-07-03 |
| 6248656 |
Metal-jacketed lead manufacturing process using resist layers |
David Rodney Baker, John Grange, Hung-Ming Wang |
2001-06-19 |
| 6217972 |
Enhancements in framed sheet processing |
Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, John W. Smith |
2001-04-17 |