Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7696439 | Layered metal structure for interconnect element | — | 2010-04-13 |
| 7309447 | Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold | Masud Beroz | 2007-12-18 |
| 7205659 | Assemblies for temporarily connecting microelectronic elements for testing and methods therefor | Masud Beroz | 2007-04-17 |
| 7152311 | Enhancements in framed sheet processing | Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, John W. Smith | 2006-12-26 |
| 7098074 | Microelectronic assemblies having low profile connections | Michael Warner, Masud Beroz, Delin Li, Dennis Castillo, Hung-Ming Wang +1 more | 2006-08-29 |
| 7067742 | Connection component with peelable leads | Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis +1 more | 2006-06-27 |
| 6825552 | Connection components with anisotropic conductive material interconnection | Paula Lagattuta Tostado, Michael Warner | 2004-11-30 |
| 6808958 | Methods of bonding microelectronic elements | — | 2004-10-26 |
| 6794202 | Assemblies for temporarily connecting microelectronic elements for testing and methods therefor | Masud Beroz | 2004-09-21 |
| 6657286 | Microelectronic assembly formation with lead displacement | — | 2003-12-02 |
| 6518160 | Method of manufacturing connection components using a plasma patterned mask | Joseph Fjelstad, Belgacem Haba | 2003-02-11 |
| 6357112 | Method of making connection component | Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, Konstantine Karavakis +1 more | 2002-03-19 |
| 6338982 | Enhancements in framed sheet processing | Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, John W. Smith | 2002-01-15 |
| 6333207 | Peelable lead structure and method of manufacture | John W. Smith | 2001-12-25 |
| 6274822 | Manufacture of semiconductor connection components with frangible lead sections | Belgacem Haba, Thomas H. DiStefano, Konstantine Karavakis | 2001-08-14 |
| 6255723 | Layered lead structures | John W. Smith, Thomas H. DiStefano, David Rodney Baker, Hung-Ming Wang | 2001-07-03 |
| 6248656 | Metal-jacketed lead manufacturing process using resist layers | David Rodney Baker, John Grange, Hung-Ming Wang | 2001-06-19 |
| 6217972 | Enhancements in framed sheet processing | Masud Beroz, Thomas H. DiStefano, Matthew T. Hendrickson, John W. Smith | 2001-04-17 |