Issued Patents All Time
Showing 25 most recent of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11653453 | Electroless and electrolytic deposition process for forming traces on a catalytic laminate | Kenneth S. Bahl | 2023-05-16 |
| 11638354 | Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil | Kenneth S. Bahl | 2023-04-25 |
| 11477893 | Catalytic laminate with conductive traces formed during lamination | Kenneth S. Bahl | 2022-10-18 |
| 10959329 | Circuit board using non-catalytic laminate with catalytic adhesive overlay | Kenneth S. Bahl | 2021-03-23 |
| 10849233 | Process for forming traces on a catalytic laminate | Kenneth S. Bahl | 2020-11-24 |
| 10827624 | Catalytic laminate with conductive traces formed during lamination | Kenneth S. Bahl | 2020-11-03 |
| 10806029 | Catalytic circuit board with traces and vias | Kenneth S. Bahl | 2020-10-13 |
| 10765003 | Method for making a multi-layer circuit board using conductive paste with interposer layer | Kenneth S. Bahl | 2020-09-01 |
| 10765012 | Process for printed circuit boards using backing foil | Kenneth S. Bahl | 2020-09-01 |
| 10685931 | Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive | Kenneth S. Bahl | 2020-06-16 |
| 10573610 | Method for wafer level packaging | Kenneth S. Bahl | 2020-02-25 |
| 10349520 | Multi-layer circuit board using interposer layer and conductive paste | Kenneth S. Bahl | 2019-07-09 |
| 10306756 | Circuit board with catalytic adhesive | Kenneth S. Bahl | 2019-05-28 |
| 9942981 | Circuit board apparatus and method | Kenneth S. Bahl | 2018-04-10 |
| 9922951 | Integrated circuit wafer integration with catalytic laminate or adhesive | Kenneth S. Bahl | 2018-03-20 |
| 9706667 | Via in a printed circuit board | Kenneth S. Bahl | 2017-07-11 |
| 9706650 | Catalytic laminate apparatus and method | Kenneth S. Bahl | 2017-07-11 |
| 9674967 | Via in a printed circuit board | Kenneth S. Bahl | 2017-06-06 |
| 9631279 | Methods for forming embedded traces | Kenneth S. Bahl, Steve Carney | 2017-04-25 |
| 9398703 | Via in a printed circuit board | Kenneth S. Bahl | 2016-07-19 |
| 9380700 | Method for forming traces of a printed circuit board | Kenneth S. Bahl, Steve Carney | 2016-06-28 |
| 8558386 | Methods of making compliant semiconductor chip packages | Joseph Fjelstad | 2013-10-15 |
| 8338925 | Microelectronic assemblies having compliant layers | Joseph Fjelstad | 2012-12-25 |
| 8004296 | Probe head apparatus for testing semiconductors | Peter T. Di Stefano, Thomas H. Di Stefano | 2011-08-23 |
| 7872344 | Microelectronic assemblies having compliant layers | Joseph Fjelstad | 2011-01-18 |