Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery

Dishing and defect control of chemical mechanical polishing using real-time adjustable additive delivery

US Patent 8210900 · Granted Jul 3, 2012

Estimated economic value: $11,712,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polishing pads for high temperature processing2024
In-situ metrology and process control2024
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pa2024
In-situ metrology and process control2022
Systems and methods for copper (I) suppression in electrochemical deposition2021
Glass surface stress meter and multiple-tempered glass surface stress meter2021
Thin plastic polishing article for CMP applications2020
Inductive monitoring of conductive loops2020
Endpoint control of multiple substrate zones of varying thickness in chemical me2020
Determination of gain for eddy current sensor2020
Modifying substrate thickness profiles2019
Determination of gain for eddy current sensor2019