Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-layer ceramic electrostatic chuck with integrated channel

Multi-layer ceramic electrostatic chuck with integrated channel

US Patent 6639783 · Granted Oct 28, 2003

Estimated economic value: $43,198,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polishing pads for high temperature processing2024
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pa2024
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanc2023
Systems and methods for copper (I) suppression in electrochemical deposition2021
Glass surface stress meter and multiple-tempered glass surface stress meter2021
Thin plastic polishing article for CMP applications2020
Seal compositions, methods, and structures for planar solid oxide fuel cells2020
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanc2020
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanc2019
Seal compositions, methods, and structures for planar solid oxide fuel cells2018
Silicon composite substrates2018
Structure and method for high performance large-grain-poly silicon backplane for2018