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Wafer bin map based root cause analysis |
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Pattern-enhanced spatial correlation of test structures to die level responses |
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Kazuki Kunitoshi |
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Anomalous equipment trace detection and classification |
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Predicting die susceptible to early lifetime failure |
Qing Zhu, Keith Arnold |
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Failure detection for wire bonding in semiconductors |
Brian E. Stine, Nobuchika Akiya |
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Advanced manufacturing insight system for semiconductor application |
Brian E. Stine, Lijin Zhu |
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Method and system for failure signal detection analysis |
Paul Lin, Spencer B. Graves, Eric Antonissen |
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Extraction method of defect density and size distributions |
Christopher Hess, David Stashower, Brian E. Stine, Larg Weiland, Dennis Ciplickas |
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Aggregate stabilizing emulsion and a mixture of the emulsion with aggregate |
— |
2004-01-27 |
| 4822425 |
Aggregate stabilization |
— |
1989-04-18 |