| 12429520 |
Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic block |
Indranil De, Marian Mankos, Dennis Ciplickas, Jeremy Cheng, Balasubramanian Murugan +1 more |
2025-09-30 |
|
| 12416663 |
Embedded system to characterize BTI degradation effects in MOSFETs |
Michele Quarantelli, Alberto Piadena, Tomasz Brozek, Larg Weiland, Sharad Saxena |
2025-09-16 |
|
| 12038476 |
Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic block |
Indranil De, Marian Mankos, Dennis Ciplickas, Jeremy Cheng, Balasubramanian Murugan +1 more |
2024-07-16 |
$4,924,000 |
| 11668746 |
Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic block |
Indranil De, Marian Mankos, Dennis Ciplickas, Jeremy Cheng, Balasubramanian Murugan +1 more |
2023-06-06 |
$15,397,000 |
| 11585642 |
Software and sensor system for controlling range equipment |
Joseph Green, Cory Haflett, Tim Hakala, David Sharp, Devin Anderson |
2023-02-21 |
|
| 11340293 |
Methods for performing a non-contact electrical measurement on a cell, chip, wafer, die, or logic block |
Indranil De, Marian Mankos, Dennis Ciplickas, Jeremy Cheng, Balasubramanian Murugan +1 more |
2022-05-24 |
$8,593,000 |
| 11107804 |
IC with test structures and e-beam pads embedded within a contiguous standard cell area |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +21 more |
2021-08-31 |
$7,464,000 |
| 11081477 |
IC with test structures and e-beam pads embedded within a contiguous standard cell area |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +21 more |
2021-08-03 |
$3,055,000 |
| 11081476 |
IC with test structures and e-beam pads embedded within a contiguous standard cell area |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +21 more |
2021-08-03 |
$3,055,000 |
| 11075194 |
IC with test structures and E-beam pads embedded within a contiguous standard cell area |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +21 more |
2021-07-27 |
$7,372,000 |
| 11018126 |
IC with test structures and e-beam pads embedded within a contiguous standard cell area |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +21 more |
2021-05-25 |
$6,881,000 |
| 10978438 |
IC with test structures and E-beam pads embedded within a contiguous standard cell area |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +21 more |
2021-04-13 |
$7,247,000 |
| 10876821 |
Software and sensor system for controlling range equipment |
Joseph Green, Cory Haflett, Tim Hakala, David Sharp, Devin Anderson |
2020-12-29 |
|
| 10854522 |
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2020-12-01 |
$4,373,000 |
| 10777472 |
IC with test structures embedded within a contiguous standard cell area |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2020-09-15 |
$3,826,000 |
| 10643735 |
Passive array test structure for cross-point memory characterization |
Tomasz Brozek, Rakesh Vallishayee, Meindert Martin Lunenborg, Hendrik Schneider, Yuan Yu +2 more |
2020-05-05 |
$1,876,000 |
| 10593604 |
Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2020-03-17 |
$2,112,000 |
| 10539402 |
Target bracket |
Devin Anderson |
2020-01-21 |
|
| 10488161 |
Walking target |
Devin Anderson |
2019-11-26 |
|
| 10380305 |
Direct probing characterization vehicle for transistor, capacitor and resistor testing |
Yih-Yuh Doong, Sheng-Che Lin, Chia-Chi Lin, Hans Eisenmann, Cho-Si Huang +2 more |
2019-08-13 |
$3,155,000 |
| 10290552 |
Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2019-05-14 |
$3,728,000 |
| 10269786 |
Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2019-04-23 |
$2,173,000 |
| 10211111 |
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2019-02-19 |
$2,031,000 |
| 10211112 |
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2019-02-19 |
$2,031,000 |
| 10199289 |
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one chamfer short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective chamfer short, corner short, and via open test areas |
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli +20 more |
2019-02-05 |
$355,000 |
