Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7229535 | Hydrogen bubble reduction on the cathode using double-cell designs | Yan Wang, Feng Q. Liu, Siew Neo, Liang-Yuh Chen, Yongqi Hu | 2007-06-12 |
| 7207878 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Feng Q. Liu, Antoine P. Manens, Siew Neo +5 more | 2007-04-24 |
| 7160432 | Method and composition for polishing a substrate | Feng Q. Liu, Liang-Yuh Chen, Stan Tsai, Siew Neo, Yongqi Hu +2 more | 2007-01-09 |
| 7137879 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Daniel Carl, Ralph Wadensweiler +4 more | 2006-11-21 |
| 7137868 | Pad assembly for electrochemical mechanical processing | Shou-Sung Chang, Stan Tsai, Donald Olgado, Liang-Yuh Chen, Ralph Wadensweiler | 2006-11-21 |
| 7128825 | Method and composition for polishing a substrate | Feng Q. Liu, Stan Tsai, Yongqi Hu, Siew Neo, Yan Wang +1 more | 2006-10-31 |
| 7112270 | Algorithm for real-time process control of electro-polishing | Antoine P. Manens, Siew Neo, Liang-Yuh Chen | 2006-09-26 |
| 7066800 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Daniel Carl, Ralph Wadensweiler +4 more | 2006-06-27 |
| 7059948 | Articles for polishing semiconductor substrates | Shijian Li, Llang-Yuh Chen | 2006-06-13 |
| 7029365 | Pad assembly for electrochemical mechanical processing | Shou-Sung Chang, Stan Tsai, Donald Olgado, Liang-Yuh Chen, Ralph Wadensweiler | 2006-04-18 |
| 6991528 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Feng Q. Liu, Antoine P. Manens, Siew Neo +5 more | 2006-01-31 |
| 6991526 | Control of removal profile in electrochemically assisted CMP | Lizhong Sun, Liang-Yuh Chen, Siew Neo, Feng Q. Liu, Stan Tsai +1 more | 2006-01-31 |
| 6988942 | Conductive polishing article for electrochemical mechanical polishing | Liang-Yuh Chen, Yuchun Wang, Yan Wang, Daniel Carl, Ralph Wadensweiler +4 more | 2006-01-24 |
| 6979248 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Feng Q. Liu, Rashid Mavliev, Liang-Yuh Chen +2 more | 2005-12-27 |
| 6977036 | Method and apparatus for substrate polishing | Ralph Wadensweiler, Liang-Yuh Chen, Manoocher Birang, Ratson Morad, Paul D. Butterfield | 2005-12-20 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2005-11-08 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing | Lizhong Sun, Feng Q. Liu, Yuchun Wang, Yan Wang, Siew Neo +1 more | 2005-05-31 |
| 6841057 | Method and apparatus for substrate polishing | Ralph Wadensweiler, Liang-Yuh Chen, Manoocher Birang, Ratson Morad, Paul D. Butterfield | 2005-01-11 |
| 6837983 | Endpoint detection for electro chemical mechanical polishing and electropolishing processes | Yan Wang, Siew Neo, Liang-Yuh Chen | 2005-01-04 |
| 6811680 | Planarization of substrates using electrochemical mechanical polishing | Liang-Yuh Chen, Wei-Yung Hsu, Ratson Morad, Daniel Carl | 2004-11-02 |
| 6776693 | Method and apparatus for face-up substrate polishing | Shou-Sung Chang, Liang-Yuh Chen, Yan Wang, Siew Neo, Lizhong Sun +1 more | 2004-08-17 |
| 6773507 | Apparatus and method for fast-cycle atomic layer deposition | Ravi Jallepally, Shih-Hung Li, Jun Zhao, Liang-Yuh Chen, Daniel Carl | 2004-08-10 |