Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451677 | Plasma-enhanced chemical vapor deposition of a nucleation layer in a tungsten metallization process | Jiong-Ping Lu, Boyang Lin | 2002-09-17 |
| 6424040 | Integration of fluorinated dielectrics in multi-level metallizations | Somnath Nag, Changming Jin, Guoqiang Xing | 2002-07-23 |
| 6334249 | Cavity-filling method for reducing surface topography and roughness | — | 2002-01-01 |
| 6329282 | Method of improving the texture of aluminum metallization for tungsten etch back processing | Qi-Zhong Hong | 2001-12-11 |
| 6323553 | Reduced temperature contact/via filling | Qi-Zhong Hong | 2001-11-27 |
| 6245605 | Method to protect metal from oxidation during poly-metal gate formation in semiconductor device manufacturing | Ming-Jang Hwang, Chih-Chen Cho, Dirk N. Anderson | 2001-06-12 |
| 6245672 | Method of forming diffusion barriers for copper metallization in integrated cirucits | Qi-Zhong Hong, Jiong-Ping Lu, Robert H. Havemann | 2001-06-12 |
| 6207561 | Selective oxidation methods for metal oxide deposition on metals in capacitor fabrication | Ming-Jang Hwang, Robert Tsu | 2001-03-27 |
| 6194313 | Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback process | Abha Singh, Girish Dixit, Guoqiang Xing | 2001-02-27 |
| 6184129 | Low resistivity poly-silicon gate produced by selective metal growth | Ming-Jang Hwang, Jiong-Ping Lu, Duane E. Carter | 2001-02-06 |
| 6150252 | Multi-stage semiconductor cavity filling process | Qi-Zhong Hong | 2000-11-21 |
| 6143645 | Reduced temperature contact/via filling | Qi-Zhong Hong | 2000-11-07 |
| 6120842 | TiN+Al films and processes | Jiong-Ping Lu, Qi-Zhong Hong | 2000-09-19 |
| 6100188 | Stable and low resistance metal/barrier/silicon stack structure and related process for manufacturing | Jiong-Ping Lu, Ming-Jang Hwang, Dick N. Anderson, Duane E. Carter | 2000-08-08 |
| 6077782 | Method to improve the texture of aluminum metallization | Qi-Zhong Hong, Robert H. Havemann | 2000-06-20 |
| 6077774 | Method of forming ultra-thin and conformal diffusion barriers encapsulating copper | Qi-Zhong Hong | 2000-06-20 |
| 6054382 | Method of improving texture of metal films in semiconductor integrated circuits | Qi-Zhong Hong | 2000-04-25 |
| 6037013 | Barrier/liner with a SiNx-enriched surface layer on MOCVD prepared films | Qi-Zhong Hong, Jiong-Ping Lu | 2000-03-14 |
| 6008117 | Method of forming diffusion barriers encapsulating copper | Qi-Zhong Hong, Shin-Puu Jeng | 1999-12-28 |
| 5998296 | Method of forming contacts and vias in semiconductor | Mukul Saran, James Garvin | 1999-12-07 |
| 5985763 | Method for producing barrier-less plug structures | Qi-Zhong Hong, Shin-Puu Jeng | 1999-11-16 |
| 5892282 | Barrier-less plug structure | Qi-Zhong Hong, Shin-Puu Jeng | 1999-04-06 |
| 5796151 | Semiconductor stack having a dielectric sidewall for prevention of oxidation of tungsten in tungsten capped poly-silicon gate electrodes | Dirk N. Anderson, Robert J. Kraft | 1998-08-18 |
| 5573979 | Sloped storage node for a 3-D dram cell structure | Robert Tsu | 1996-11-12 |
| 5528153 | Method for non-destructive, non-contact measurement of dielectric constant of thin films | Kelly Taylor | 1996-06-18 |