Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351737 | Chemical mechanical polishing of substrates containing copper and ruthenium | Haci Osman GUEVENC, Michael Lauter, Te Yu Wei, Wei-Lan Chiu, Julian Proelss +1 more | 2025-07-08 |
| 11993729 | Chemical mechanical polishing composition | Christian Daeschlein, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim +4 more | 2024-05-28 |
| 11725117 | Chemical mechanical polishing of substrates containing copper and ruthenium | Haci Osman GUEVENC, Michael Lauter, Te Yu Wei, Wei-Lan Chiu, Julian Proelss +1 more | 2023-08-15 |
| 11286402 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Robert REICHARDT, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim +3 more | 2022-03-29 |
| 11264250 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Robert REICHARDT, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim +3 more | 2022-03-01 |
| 10899945 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates | Robert REICHARDT, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim +4 more | 2021-01-26 |
| 10738219 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Robert REICHARDT, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim +3 more | 2020-08-11 |
| 10570316 | Chemical mechanical polishing (CMP) composition | Robert REICHARDT, Max Siebert, Yongqing Lan, Michael Lauter, Haci Osman GUEVENC +2 more | 2020-02-25 |
| 10385236 | Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates | Robert REICHARDT, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim +3 more | 2019-08-20 |
| 10214663 | Chemical-mechanical polishing composition comprising organic/inorganic composite particles | Yongqing Lan, Bastian Marten Noller, Yuzhuo Li, Liang Jiang, Daniel Kwo-Hung Shen | 2019-02-26 |
| 7405419 | Unidirectionally conductive materials for interconnection | Robert Meagley, Seiichi Morimoto, Mansour Moinpour | 2008-07-29 |
| 7229484 | Pre-coated particles for chemical mechanical polishing | Mansour Moinpour, Andrea Oehler | 2007-06-12 |
| 7156947 | Energy enhanced surface planarization | — | 2007-01-02 |
| 7153760 | Using acoustic energy including two lasers to activate implanted species | — | 2006-12-26 |
| 7097536 | Electrically enhanced surface planarization | — | 2006-08-29 |
| 7084053 | Unidirectionally conductive materials for interconnection | Robert Meagley, Seiichi Morimoto, Mansour Moinpour | 2006-08-01 |
| 6976907 | Polishing pad conditioning | Mansour Moinpour | 2005-12-20 |
| 6875086 | Surface planarization | Mansour Moinpour | 2005-04-05 |
| 6419553 | Methods for break-in and conditioning a fixed abrasive polishing pad | Vilas Koinkar, Matthew VanHanehem, Qiuliang Luo, James Shen, Peter A. Burke | 2002-07-16 |
| 6406641 | Liquid etch endpoint detection and process metrology | — | 2002-06-18 |