Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12378439 | Compositions for tungsten etching inhibition | Michael Lauter, Haci Osman GUEVENC, Te Yu Wei | 2025-08-05 |
| 12351737 | Chemical mechanical polishing of substrates containing copper and ruthenium | Haci Osman GUEVENC, Michael Lauter, Te Yu Wei, Reza Golzarian, Julian Proelss +1 more | 2025-07-08 |
| 12087665 | Through substrate via structure and manufacturing method thereof, redistribution layer structure and manufacturing method thereof | Hsiang-Hung Chang | 2024-09-10 |
| 11725117 | Chemical mechanical polishing of substrates containing copper and ruthenium | Haci Osman GUEVENC, Michael Lauter, Te Yu Wei, Reza Golzarian, Julian Proelss +1 more | 2023-08-15 |
| 10520422 | Optical micro-particles detector | Hsiang-Hung Chang | 2019-12-31 |
| 10161054 | Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same | Chih-Jung Chen, Yi-Chia Chou | 2018-12-25 |
| 9758886 | Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same | Chih-Jung Chen, Yi-Chia Chou | 2017-09-12 |
| 9070632 | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers | Vijay Immanuel Raman, Frank Rittig, Yuzhuo Li | 2015-06-30 |
| 8980750 | Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt | Robert REICHARDT, Yuzhuo Li, Michael Lauter | 2015-03-17 |
| 8957323 | Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same | Chih-Wei Chen | 2015-02-17 |