YL

Yuzhuo Li

Basf Se: 24 patents #509 of 13,826Top 4%
DO Dynea Chemicals Oy: 2 patents #3 of 26Top 15%
FE Ferro: 2 patents #125 of 431Top 30%
PO Ppg Industries Ohio: 2 patents #525 of 1,316Top 40%
GE: 2 patents #13,562 of 36,430Top 40%
ZU Zhejiang University: 1 patents #773 of 2,379Top 35%
TI Tbw Industries: 1 patents #2 of 4Top 50%
Overall (All Time): #93,602 of 4,157,543Top 3%
36
Patents All Time

Issued Patents All Time

Showing 25 most recent of 36 patents

Patent #TitleCo-InventorsDate
11751512 Woody rootstock for efficient grafting of solanaceous vegetables and efficient grafting and seedling culture method thereof Liping Chen, Tingjin Wang, Lu Yuan, Ke Liu, Aijun Zhang +3 more 2023-09-12
11168239 Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors Robert REICHARDT, Martin Kaller, Michael Lauter, Andreas Klipp 2021-11-09
10647900 Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors Robert REICHARDT, Martin Kaller, Michael Lauter, Andreas Klipp 2020-05-12
10407594 Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine Bastian Marten Noller, Diana Franz, Kenneth Rushing, Michael Lauter, Daniel Kwo-Hung Shen +2 more 2019-09-10
10392531 Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process Vijay Immanuel Raman, Sophia Ebert, Mario Brands, Yongqing Lan, Philipp Zacharias +1 more 2019-08-27
10214663 Chemical-mechanical polishing composition comprising organic/inorganic composite particles Yongqing Lan, Bastian Marten Noller, Liang Jiang, Daniel Kwo-Hung Shen, Reza Golzarian 2019-02-26
9777192 Chemical mechanical polishing (CMP) composition comprising a protein Bastian Marten Noller, Michael Lauter, Roland Lange 2017-10-03
9496146 Method for forming through-base wafer vias Changxue Wang, Daniel Kwo-Hung Shen 2016-11-15
9487674 Chemical mechanical polishing (CMP) composition comprising a glycoside Michael Lauter, Roland Lange 2016-11-08
9487675 Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives Vijay Immanuel Raman, Christian Schade, Shyam Sundar Venkataraman, Eason Yu-Shen Su, Sheik Ansar Usman Ibrahim 2016-11-08
9458415 Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid Shyam Sundar Venkataraman, Mingjie Zhong 2016-10-04
9443739 Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or Si1-xGex material in the presence of a CMP composition comprising a specific organic compound Bastian Marten Noller, Bettina Drescher, Christophe Gillot 2016-09-13
9416298 Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant Bastian Marten Noller, Christophe Gillot, Diana Franz 2016-08-16
9309448 Abrasive articles, method for their preparation and method of their use Christof Kujat, Kenneth Rushing 2016-04-12
9263296 Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors Bastian Marten Noller, Michael Lauter, Albert Budiman Sugiharto, Kenneth Rushing, Diana Franz +1 more 2016-02-16
9255214 Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles Michael Lauter, Vijay Immanuel Raman, Shyam Sundar Venkataraman, Daniel Kwo-Hung Shen 2016-02-09
9070632 Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers Vijay Immanuel Raman, Frank Rittig, Wei-Lan Chiu 2015-06-30
9028708 Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process Vijay Immanuel Raman, Mario Brands, Yongqing Lan, Kenneth Rushing, Karpagavalli Ramji 2015-05-12
9005472 Aqueous polishing agent and graft copolymers and their use in a process for polishing patterned and unstructured metal surfaces Vijay Immanuel Raman, Ilshat Gubaydullin, Mario Brands, Maxim Peretolchin 2015-04-14
8980750 Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt Robert REICHARDT, Michael Lauter, Wei-Lan Chiu 2015-03-17
8927429 Chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid Christine Schmitt, Andrey Karpov, Frank Rosowski, Mario Brands 2015-01-06
8747687 Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfaces Vijay Immanuel Raman, Ilshat Gubaydullin, Mario Brands, Yongqing Lan 2014-06-10
8684793 Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization Karpagavalli Ramji 2014-04-01
8679980 Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process Vijay Immanuel Raman, Ilshat Gubaydullin, Mario Brands, Yongqing Lan 2014-03-25
8597539 Chemical mechanical polishing (CMP) polishing solution with enhanced performance Harvey Wayne Pinder, Shyam Sundar Venkataraman 2013-12-03