Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068283 | Die stack with cascade and vertical connections | Min-Tih Lai, Florence R. Pon, Yuhong Cai | 2024-08-20 |
| 11901274 | Packaged integrated circuit device with recess structure | Bin Liu, Florence R. Pon | 2024-02-13 |
| 11817438 | System in package with interconnected modules | Hyoung Il Kim, Bilal Khalaf, Juan E. Dominguez | 2023-11-14 |
| 11552051 | Electronic device package | Florence R. Pon | 2023-01-10 |
| 11335640 | Microelectronic structures having notched microelectronic substrates | — | 2022-05-17 |
| 11171114 | Die stack with cascade and vertical connections | Min-Tih Lai, Florence R. Pon, Yuhong Cai | 2021-11-09 |
| 11145632 | High density die package configuration on system boards | Juan E. Dominguez, Hyoung Il Kim, Bilal Khalaf | 2021-10-12 |
| 10964682 | Data storage system using wafer-level packaging | Leo Craft | 2021-03-30 |
| 10910347 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, Zhicheng Ding, Richard Patten | 2021-02-02 |
| 10872832 | Pre-molded active IC of passive components to miniaturize system in package | Mao Guo, Yong She, Bin Liu, Lingyan L. Tan | 2020-12-22 |
| 10490516 | Packaged integrated circuit device with cantilever structure | Bilal Khalaf, Sireesha Gogineni, Brian J. Long | 2019-11-26 |
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, Zhicheng Ding, Richard Patten | 2019-08-27 |
| 9871007 | Packaged integrated circuit device with cantilever structure | Bilal Khalaf, Sireesha Gogineni, Brian J. Long | 2018-01-16 |
| 9441660 | Mounting insert and method | — | 2016-09-13 |
| 7533457 | Packaging method for circuit board | Richard Foehringer, Jason Snodgress, Steven Eskildsen | 2009-05-19 |
| 7503155 | Method for packaging a tape substrate | — | 2009-03-17 |
| 7498201 | Method of forming a multi-die semiconductor package | — | 2009-03-03 |
| 6927497 | Multi-die semiconductor package | — | 2005-08-09 |