John G. Meyers has been granted 18 US patents while listed as an inventor at Intel . The first was granted in 2005 and the most recent in August 2024. John G. Meyers ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list John G. Meyers in Hamburg, CA, DE.
Patents per Year Patents granted per year, 2005 to 2024 Bar chart with a peak of 4 patents in 2021. peak 4 2005: 1 patents 2005 2009: 3 patents 2009 2016: 1 patents 2016 2018: 1 patents 2018 2019: 2 patents 2019 2020: 1 patents 2020 2021: 4 patents 2021 2022: 1 patents 2022 2023: 2 patents 2023 2024: 2 patents 2024
Issued Patents All Time
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Showing 1–18 of 18 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
12068283 Die stack with cascade and vertical connections Min-Tih Lai , Florence R. Pon , Yuhong Cai 2024-08-20
$20,163,000
11901274 Packaged integrated circuit device with recess structure Bin Liu , Florence R. Pon 2024-02-13
$18,546,000
11817438 System in package with interconnected modules Hyoung Il Kim , Bilal Khalaf , Juan E. Dominguez 2023-11-14
11552051 Electronic device package Florence R. Pon 2023-01-10
$14,061,000
11335640 Microelectronic structures having notched microelectronic substrates — 2022-05-17
$14,251,000
11171114 Die stack with cascade and vertical connections Min-Tih Lai , Florence R. Pon , Yuhong Cai 2021-11-09
$28,241,000
11145632 High density die package configuration on system boards Juan E. Dominguez , Hyoung Il Kim , Bilal Khalaf 2021-10-12
$32,982,000
10964682 Data storage system using wafer-level packaging Leo Craft 2021-03-30
$32,599,000
10910347 Method, apparatus and system to interconnect packaged integrated circuit dies Yong She , Zhicheng Ding , Richard Patten 2021-02-02
$28,243,000
10872832 Pre-molded active IC of passive components to miniaturize system in package Mao Guo , Yong She , Bin Liu , Lingyan L. Tan 2020-12-22
$47,741,000
10490516 Packaged integrated circuit device with cantilever structure Bilal Khalaf , Sireesha Gogineni , Brian J. Long 2019-11-26
$25,149,000
10396055 Method, apparatus and system to interconnect packaged integrated circuit dies Yong She , Zhicheng Ding , Richard Patten 2019-08-27
$17,353,000
9871007 Packaged integrated circuit device with cantilever structure Bilal Khalaf , Sireesha Gogineni , Brian J. Long 2018-01-16
$17,139,000
9441660 Mounting insert and method — 2016-09-13
7533457 Packaging method for circuit board Richard Foehringer , Jason Snodgress , Steven Eskildsen 2009-05-19
$16,372,000
7503155 Method for packaging a tape substrate — 2009-03-17
7498201 Method of forming a multi-die semiconductor package — 2009-03-03
$13,073,000
6927497 Multi-die semiconductor package — 2005-08-09
$18,014,000
