Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266591 | Choked flow cooling | Mark Forsnes, Florence R. Pon, Yi Xu | 2025-04-01 |
| 12068283 | Die stack with cascade and vertical connections | Min-Tih Lai, Florence R. Pon, John G. Meyers | 2024-08-20 |
| 11948917 | Die over mold stacked semiconductor package | Florence R. Pon, Yi Xu, James Zhang, Tyler Leuten, William T. Glennan +1 more | 2024-04-02 |
| 11901264 | Choked flow cooling | Mark Forsnes, Florence R. Pon, Yi Xu | 2024-02-13 |
| 11894334 | Dual head capillary design for vertical wire bond | Bilal Khalaf, Yi Xu | 2024-02-06 |
| 11848292 | Pad design for thermal fatigue resistance and interconnect joint reliability | Sireesha Gogineni, Yi Xu | 2023-12-19 |
| 11694976 | Bowl shaped pad | Sireesha Gogineni, Yi Xu | 2023-07-04 |
| 11569144 | Semiconductor package design for solder joint reliability | Yi Xu | 2023-01-31 |
| 11476174 | Solder mask design for delamination prevention | James Zhang, Yi Xu | 2022-10-18 |
| 11171114 | Die stack with cascade and vertical connections | Min-Tih Lai, Florence R. Pon, John G. Meyers | 2021-11-09 |
| 10573575 | Semiconductor package with thermal fins | Hyoung Il Kim, Florence R. Pon, Yi Xu, Min-Tih Lai, Leo Craft | 2020-02-25 |
| 10192840 | Ball pad with a plurality of lobes | Mao Guo | 2019-01-29 |
| 10051763 | Local stress-relieving devices, systems, and methods for electronic assemblies | Min-Thi Lai, Garrick Chow, Lianhua Fan | 2018-08-14 |