Yuhong Cai — 13 Patents at Intel

Yuhong Cai has been granted 13 US patents while listed as an inventor at Intel. The first was granted in 2018 and the most recent in April 2025. Yuhong Cai ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Yuhong Cai in Folsom, CA, US.

Patents per Year

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Showing 1–13 of 13 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12266591	Choked flow cooling	Mark Forsnes, Florence R. Pon, Yi Xu	2025-04-01
12068283	Die stack with cascade and vertical connections	Min-Tih Lai, Florence R. Pon, John G. Meyers	2024-08-20	$20,163,000
11948917	Die over mold stacked semiconductor package	Florence R. Pon, Yi Xu, James Zhang, Tyler Leuten, William T. Glennan +1 more	2024-04-02	$34,819,000
11901264	Choked flow cooling	Mark Forsnes, Florence R. Pon, Yi Xu	2024-02-13
11894334	Dual head capillary design for vertical wire bond	Bilal Khalaf, Yi Xu	2024-02-06	$35,892,000
11848292	Pad design for thermal fatigue resistance and interconnect joint reliability	Sireesha Gogineni, Yi Xu	2023-12-19	$50,836,000
11694976	Bowl shaped pad	Sireesha Gogineni, Yi Xu	2023-07-04
11569144	Semiconductor package design for solder joint reliability	Yi Xu	2023-01-31	$11,941,000
11476174	Solder mask design for delamination prevention	James Zhang, Yi Xu	2022-10-18	$11,317,000
11171114	Die stack with cascade and vertical connections	Min-Tih Lai, Florence R. Pon, John G. Meyers	2021-11-09	$28,241,000
10573575	Semiconductor package with thermal fins	Hyoung Il Kim, Florence R. Pon, Yi Xu, Min-Tih Lai, Leo Craft	2020-02-25	$18,813,000
10192840	Ball pad with a plurality of lobes	Mao Guo	2019-01-29	$23,219,000
10051763	Local stress-relieving devices, systems, and methods for electronic assemblies	Min-Thi Lai, Garrick Chow, Lianhua Fan	2018-08-14	$20,895,000

Yuhong Cai — 13 Patents

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