Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046581 | Integrated circuit package with glass spacer | Mao Guo, Hyoung Il Kim, Yong She | 2024-07-23 |
| 11881441 | Stacked die semiconductor package spacer die | Andrew Tae Kim, Yong She, Karissa J. Blue | 2024-01-23 |
| 11848292 | Pad design for thermal fatigue resistance and interconnect joint reliability | Yi Xu, Yuhong Cai | 2023-12-19 |
| 11694976 | Bowl shaped pad | Yuhong Cai, Yi Xu | 2023-07-04 |
| 11393788 | Integrated circuit package with glass spacer | Mao Guo, Hyoung Il Kim, Yong She | 2022-07-19 |
| 10490516 | Packaged integrated circuit device with cantilever structure | John G. Meyers, Bilal Khalaf, Brian J. Long | 2019-11-26 |
| 9871007 | Packaged integrated circuit device with cantilever structure | John G. Meyers, Bilal Khalaf, Brian J. Long | 2018-01-16 |