Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046581 | Integrated circuit package with glass spacer | Hyoung Il Kim, Yong She, Sireesha Gogineni | 2024-07-23 |
| 11393788 | Integrated circuit package with glass spacer | Hyoung Il Kim, Yong She, Sireesha Gogineni | 2022-07-19 |
| 11373974 | Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size | Bilal Khalaf | 2022-06-28 |
| 10872832 | Pre-molded active IC of passive components to miniaturize system in package | John G. Meyers, Yong She, Bin Liu, Lingyan L. Tan | 2020-12-22 |
| 10756072 | Conductive wire through-mold connection apparatus and method | — | 2020-08-25 |
| 10748873 | Substrates, assembles, and techniques to enable multi-chip flip chip packages | Min-Tih Lai, Tyler Leuten | 2020-08-18 |
| 10511008 | Battery contact with a surface texture | James Brush, Brent M. Willey, William S. Miller | 2019-12-17 |
| 10192840 | Ball pad with a plurality of lobes | Yuhong Cai | 2019-01-29 |
| 9859255 | Electronic device package | Jh Yoon, Yong She, Richard Patten | 2018-01-02 |