{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Microelectronic structures having notched microelectronic substrates", "item": "https://www.patentleaderboard.com/patent/11335640"}]}
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Home › Microelectronic structures having notched microelectronic substrates

Microelectronic structures having notched microelectronic substrates

US Patent 11335640 · Granted May 17, 2022

Estimated economic value: $14,251,000 ⓘ

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